New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

Download the white paper to see how the new COM Express® mini modules deliver maximum Intel® Core™ performance in ultra-compact, rugged edge-computing designs.

When space is the limiting factor

COM Express® mini Specification

Technical features of COMe-mRP10 (E2)

Maximum flexibility for Edge Applications

COM Express® mini vs. COM-HPC® Mini

Comprehensive support and services

White Paper Overview

This white paper introduces the world’s first COM Express^® mini modules featuring 13th Gen Intel^® Core™ mobile processors, enabling powerful AI analytics, machine vision, and real-time industrial workloads in extremely space-constrained environments. Learn how the hybrid-core architecture, LPDDR5(x) memory, NVMe storage options, and industrial-temperature SKUs support next-generation embedded systems—from medical devices to smart transportation, compact IoT gateways, and mobile robotics—while maintaining long-term availability, scalability, and design flexibility across multiple form factors.