Industry White Paper

Robust Ethernet Physical Layer Solutions for Time Critical Communications in Harsh Industrial Environments

February 04, 2021 by Analog Devices Download PDF

White Paper Overview

Industrial systems are increasingly adopting Ethernet connectivity to solve manufacturers’ key Industry 4.0 and smart factory communication challenges. These challenges include data integration, synchronization, edge connectivity, and system interoperability. Ethernet-connected factories enable higher manufacturing productivity, and more flexible and scalable manufacturing by enabling connectivity between information technology (IT) and operating technology (OT) networks. This allows all areas of the factory to be monitored and controlled on a single, seamless, secure, and high bandwidth network that supports time-critical communications.

To enable seamless connectivity of the IT and OT networks and unlock the value of Industry 4.0, enhanced physical layer technology designed for industrial application is a key design choice. Robust Industrial Ethernet PHYs technology that solve the challenges of power, latency, solution size, 105°C ambient temperature, robustness (EMC/ESD), and long product lifetime are the foundation of the connected factory. To address the challenges outlined in this article, Analog Devices has recently released two new robust Industrial Ethernet PHYs, the ADIN1300 (10 Mbps/100 Mbps/1000 Mbps) and ADIN1200 (10 Mbps/100 Mbps/1000 Mbps). 

In this white paper by Analog Devices, learn more about industrial ethernet physical layers, requirements for industrial applications, and the newly released industrial ethernet PHY technology developed to address the outlined challenges. 

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