Taking 2.5D/3DIC physical verification to the next level

Industry White Paper

Taking 2.5D/3DIC physical verification to the next level

White Paper Overview

As package designs evolve, so do verification requirements and challenges. Designers working on multi-die, multi-chiplet stacked configurations in 2.5/3D IC designs can now use enhanced Calibre 3DSTACK physical verification checks to verify die alignments for proper connectivity and electrical behavior. In this white paper by Siemens, learn how a Calibre 3DSTACK precheck mode enables design teams to find and correct basic implementation mistakes and systemic errors before invoking the Calibre 3DSTACK signoff run, eliminating unnecessary debugging iterations and speeding up the overall package verification flow.

AI / Neural Networks

Consumer Electronics

Digital Signal Processing

Engineering Consulting

Industrial Automation

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