Industry White Paper

Top Cool Package for Power Discrete MOSFETs

December 14, 2022 by onsemi
Topics Covered
  • Top Cool Layout Benefits
  • Top Cool Thermal Benefits
  • Thermal Performance Comparison Test Set−up
  • Device Selection and PCB Layout
  • Heatsink and Thermal Interface Material (TIM)
  • Test Circuit and Heating/Measuring Method

Application Note Overview

Cooling has always been a challenge when it comes to power design. onsemi offers the new top cooling MOSFETs to address this issue by changing the heatsink to the top of the device. This allows heat to be dissipated directly into a heatsink while heat propagation is mainly through printed circuit board with typical surface mount devices. The top cool package also reduces the size of PCB and improves thermal performance. This application note discusses all of the benefits of implementing top cool MOSFETs in your system.