Industry White Paper

Using Vias to Improve PCB Density

June 18, 2020 by Advanced Assembly

Overview

Vias are incredibly small yet integral circuit board components, interconnecting layers of multi-layer printed circuit board (PCB). While component lead can enter a plated through hole, nothing can enter a via hole for soldering. 

Vias do not need to extend from one side of the board to the other, although they can do so as a through via. While blind vias start at one surface on one side of the board and do not extend to the other side, buried vias remain encapsulated within the board. There are seven identifiable types of vias, as determined by the IPC-T-50M, the standard for Terms and Definitions for Interconnecting and Packaging Electronic Circuits.

With proper design and by following best practices, alongside multiple ultrathin layers, laser-drilled microvias, via-in-pads, and staggered vias, designers can make their PCBs suitable for the latest electronic technology.

In this Advanced Assembly white paper, learn more about the different types of vias and how they are used to significantly improve PCB density. 

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