Infineon Debuts Pair of Rugged MEMS Microphones for Harsh Environments

Infineon Technologies has introduced two new digital MEMS microphones, the IM72D128V and IM69D129F (datasheets linked). Infineon engineered the additions to the company’s Xensiv lineup for robust audio performance in rough operating conditions such as industrial monitoring, outdoor audio capture, and compact consumer devices.

Infineon's new digital MEMS microphones. 

Both devices use Infineon’s Sealed Dual Membrane (SDM) technology, delivering IP57-level dust and water resistance at the component level and supporting the demands of modern voice interface and array applications.

Built for Demanding Environments

The new Xensiv microphones are equipped to handle environmental stress without sacrificing performance. The IM72D128V features a high signal-to-noise ratio (SNR) of 71.5 dB(A) and ultra-low current consumption of 430 µA in high-performance mode and just 160 µA in low-power mode. 

Block diagram of the IM72D128VV01. 

Its sealed MEMS design prevents water and dust ingress at the membrane level, eliminating common failure modes such as electric leakage or mechanical blockage. These specs make it well-suited for far-field pick-up in ANC headphones, smart speakers, or rugged monitoring systems. 

The IM69D129F, slightly smaller at 3.5 mm x 2.65 mm x 0.98 mm³, offers a still-impressive SNR of 69 dB(A), while operating at 450 µA (high performance) and 170 µA (low power). Both support a flat frequency response from 11 Hz upwards and feature digital pulse-density modulation outputs with built-in sigma-delta ADCs for easy integration into modern audio platforms.

Energy Efficiency Meets Audio Precision

While Infineon’s proprietary SDM technology is key to the microphones’ environmental robustness, their ability to operate with minimal power draw is equally important. Both microphones allow dynamic switching between performance profiles without introducing audio artifacts, a significant feature for battery-operated devices that must balance standby power and active audio performance. 

Typical stereo mode configuration of the IM69D129FV01. 

Each unit is factory-calibrated to within ±1 dB of sensitivity, which simplifies the use of multiple microphones in array configurations while maintaining phase and amplitude consistency. Additional specifications, such as a low total harmonic distortion (THD) of 0.1% at 94 dB SPL and a 128-dB SPL acoustic overload point, enable these MEMS microphones to handle both quiet and loud sound environments without clipping or distortion.

A Fit for Diverse Audio Systems

The IM72D128V and IM69D129F target a wide spectrum of use cases ranging from consumer electronics to industrial systems. Applications include ANC earbuds, laptops, smart home devices, security systems, and IoT nodes with voice control. Their small form factor and environmental compliance (IEC 60747, JEDEC 47/20/22) position them as drop-in solutions for OEMs building ruggedized audio systems. 

Multi-microphone arrays for spatial audio, beamforming, and AI-driven audio analysis stand to benefit from the high uniformity and precise timing characteristics these microphones deliver. By combining compact size, low power, and high fidelity, Infineon engineered its new Xensiv microphones to meet the growing demand for durable, efficient audio sensing in today’s most challenging environments.

All images used courtesy of Infineon.