Amphenol ICC OSFP Interconnect System | New Product BriefOctober 22, 2019 by Mouser Electronics
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Amphenol ICC OSFP Interconnect System
Amphenol ICC’s OSFP Interconnect System features 60 contacts per port on a 0.6mm pitch, supporting 56Gbps PAM4 and 25Gbps NRZ transmission. With 8 high-speed channels, this enables up to 400Gbps PAM4 and 200Gbps NRZ aggregate bandwidth.
There are also 10 power and control pins providing up to 16W of power per port independent of cage configurations, allowing copper and optical devices to be used without thermal management concerns. The system was designed with advanced internal grounding features for improved signal integrity and the potential to upgrade to 112Gbps PAM4 in the future.
Amphenol ICC offers SMT connectors with optional solder rings for board-to-board connections, inline cages up to 1x4, and combo ports up to 2x6.
- 60 contacts per port on 0.6mm pitch
- Enables 56Gbps PAM4 and 25Gbps NRZ per channel transmission
- 8 high-speed channels per port
- 400G/200G aggregate bandwidth capacity
- 10 power/control pins
- Up to 16W per port independent of cage configurations
- Use DAC and optical devices without thermal management concerns
- Advanced internal grounding for improved crosstalk/SI
- Potential to upgrade to PAM4 112Gbps
- SMT connectors, cages, and combo ports
- Cages up to 1x4
- Combo ports up to 2x6
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