At the Applied Power and Electronics Conference (APEC), Murata introduced several new components. AAC had a chance to catch up with Charlie Swiontek, Murata's Director of Strategic Marketing, to discuss the components and trends in electrical engineering.
Fully-Integrated 6A Buck Regulator
At APEC, Murata displayed their recently-released fully-integrated 6A buck regulator with a claim to be the world's smallest and most efficient module of this kind. Murata states that the MYMGA1R86RELC2RA's footprint is 25 percent less than comparable models and has a 30 percent lower profile with dimensions of 12 mm x 9 mm x 2 mm.
The 12mm x 9mm x 2mm MYMGA1R86RELC2RA buck regulator. Image courtesy Murata.
Designed for 2-cell, 3-cell, and 12V point-of-load applications, the buck regulator features an input voltage range of 5.5V–14.4V and a programmable output of 0.7V–1.8V at up to 6 amps. For 12V input to 1.8V output, the module's peak efficiency is above 90 percent.
The MYMGA1R86RELC2RA maintains its high efficiency through integrating all passive components, including bulk output capacitance, so that no external components are needed to meet transient requirements. This power architecture also reduces EMI emissions and input ripple, and allows for a temperature range of -40 to +105 degrees Celcius with derating.
According to Swiontek, the applications for this module will be in two main areas: "The general computing market, where [designers are] looking to get some density onto the card, and then vehicular devices. Murata is has a lot of wireless and Bluetooth connectivity, and cars are going to be wirelessly connected sooner or later. So you'll have to power those kinds of things. You can also power cameras with them, so there are a lot of applications in the vehicular space."
Murata also mentions telecoms, networking switches, base stations, routers and micro-servers, and high-performance mobile computing platforms as other applications.
Mass production will begin later in 2019, with sampling available for $10 in August.
Ultra-small Wi-Fi and Bluetooth Combo Module
Developed in collaboration with Cypress Semiconductor, the CYW43012 chipset is the basis for the Type 1LV module aimed at the IoT, wearables, smart home products, and portable audio applications.
The Type 1LV supports a broad range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP Camera platforms, as well as Linux and RTOS based applications. The CYW43012 chipset base provides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on Bluetooth.
The Type 1LV internally ensures optimized Wi-Fi and Bluetooth coexistence for maximum performance. For example, an embedded Ipv6 network stack can keep the host processor in sleep mode while maintaining network connections.
Communications module measures only 10.00 mm by 7.2 mm by 1.4 mm. Image courtesy Murata.
The Type 1LV module supports many standards, including BLE 2Mbps, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The new module provides enhanced security and optimal performance in Wi-Fi 5 networks. A reference antennae design for FCC/IC certifications and CE-conducted test is planned to provide a lower development cost and faster time to market.
The 1LV operates from a supply voltage of 3.2V to 4.4V over a temperature range of –20 °C to +70 °C. It is a surface mounted (SMT) device that comes in a land grid array (LGA) package.
The module is compliant with the European Union’s CE standard, as well as with ISO9001.
Improvements over Previous Devices
The new CYW43012 represents a great improvement in power consumption over the older CYW4343W. The latter formed the core of the previous 1DX module.
Chart images courtesy Murata.
Designers looking to work with the module can order evaluation kits from Murata.
Other Market Entries
One-package solutions enabling low-power communications over Wi-Fi and Bluetooth are one of the hottest fields of endeavor in electronics today. So, not surprisingly, this joint effort of Murata and Cypress is not alone in the market. Here are two examples.
Sierra Wireless’s BX310x Wi-Fi and Bluetooth Combo Modules enable communication over Wi-Fi 802.11 b/g/n at 2.4GHz, 1x1 SISO and dual-mode simultaneous Bluetooth Low Energy 4.2 and Classic Bluetooth with backwards compatibility.
Texas Instruments’ WL18x7MOD is an 8 dual-band industrial nodule for Wi-Fi, Bluetooth, and Bluetooth Low Energy (LE). It, too is a small form factor module, measuring 13.3 mm × 13.4 mm × 2 mm.
What do you think of the industry's move toward combo modules? Share your expertise in the comments.
Featured image courtesy Murata.