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Thermal Aging in Molded Power Inductors
The demand for higher power density and efficiency stresses electronic components, particularly molded power inductors. Exposure to high temperatures increases thermal aging risks. To ensure stability and efficiency, especially in high-current applications, designers use powdered magnetic alloy inductors and consider factors like inductance, resistance, and power losses.
The drive for increased power density, efficiency, and miniaturization in electronics has pushed system components to their limits. This has led to passive electronic components, including molded power inductors, facing higher temperatures and greater thermal aging risks. Even components with AEC-Q200 Grade 0 qualification, designed for temperatures between -55 °C and 150 °C, can struggle with prolonged high-temperature exposure.
This whitepaper will explore the challenges faced by molded high-current power inductors under extended high temperatures and the importance of considering thermal aging when selecting inductors.
As operating current and temperature rise, ferrite-core power inductors become more prone to magnetic saturation, which can cause sudden inductance drops and system failures. To counter this, designers often use molded power inductors made from powdered magnetic alloys, which offer better performance stability at high temperatures and high currents.
However, saturation current is just one factor in inductor selection.
Other crucial characteristics include inductance, temperature rise relative to rated current, DC resistance, and AC and DC power losses, all of which vary based on the application. To meet efficiency requirements exceeding 95% and ensure high-temperature stability and long-term reliability, molded power inductors must operate with minimal power losses and maintain stable magnetic properties.
