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New CVD Technology Allows Smaller Chip Packaging for SoCs and SiPs
February 03, 2017 by Zabrel Holsman
Zabrel studied nuclear engineering at Oregon State University. He currently works as a freelance web developer, but still has a passion for computer hardware. When he's not working he enjoys snowboarding, boxing, watching football, and hanging out with his two dogs.
February 03, 2017 by Zabrel Holsman
November 04, 2016 by Zabrel Holsman