New Product

Ohmite P Series Heatsinks | Tech Specs

July 12, 2019 by TTI, Inc

This series takes heat release in a different direction than other traditional heatsinks.

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.

Ohmite P Series Heatsinks

Heatsinks are great at getting heat out of electronics, but most of them make you force air in one direction or the other. This doesn’t seem like a big deal, but it can be a critical issue for a variety of designs. Ohmite’s P series heatsinks use Forged Pin technology in place of traditional extruded fins, allowing forced convection cooling in multiple directions. 

P series heatsinks use a universal cam clip system to attach to the device and are thru-hole soldered to the PCB. Heatsinks are available in single or dual configurations for TO-220, TO-247, and TO-264 packages and are the ideal thermal solution for compact, high power electronics. The pin fin design also provides increased surface area for minimum thermal flow impedance. 

They’re available with or without a black anodized finish and can be used with natural or forced convection cooling.

  • Forged pin design allows forced convection cooling in multiple directions
  • Universal cam clip system
  • 1U or 2U configurations for TO-220, TO-247, TO-264
  • Forged pin provides increased surface area
  • Thermal resistance as low as 3.13°C/W
  • Optional anodized finish

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