Ohmite P Series Heatsinks | Tech Specs
This series takes heat release in a different direction than other traditional heatsinks.
This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Ohmite P Series Heatsinks
Heatsinks are great at getting heat out of electronics, but most of them make you force air in one direction or the other. This doesn’t seem like a big deal, but it can be a critical issue for a variety of designs. Ohmite’s P series heatsinks use Forged Pin technology in place of traditional extruded fins, allowing forced convection cooling in multiple directions.
P series heatsinks use a universal cam clip system to attach to the device and are thru-hole soldered to the PCB. Heatsinks are available in single or dual configurations for TO-220, TO-247, and TO-264 packages and are the ideal thermal solution for compact, high power electronics. The pin fin design also provides increased surface area for minimum thermal flow impedance.
They’re available with or without a black anodized finish and can be used with natural or forced convection cooling.
- Forged pin design allows forced convection cooling in multiple directions
- Universal cam clip system
- 1U or 2U configurations for TO-220, TO-247, TO-264
- Forged pin provides increased surface area
- Thermal resistance as low as 3.13°C/W
- Optional anodized finish
New Industry Products are a form of content that allows industry partners to share useful news, messages, and technology with All About Circuits readers in a way editorial content is not well suited to. All New Industry Products are subject to strict editorial guidelines with the intention of offering readers useful news, technical expertise, or stories. The viewpoints and opinions expressed in New Industry Products are those of the partner and not necessarily those of All About Circuits or its writers.