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3M Thermal Interface Solutions | New Product Brief

June 17, 2019 by Mouser Electronics

From thermally conductive interface pads to tapes, 3M Thermal Interface Solutions can withstand high flammability.

This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.

3M Thermal Interface Solutions

3M Thermal Interface Solutions include thermally conductive interface pads and tapes providing high levels of conductivity for a wide range of applications, with flammability ratings up to UL94V-0.

3M offers silicone and acrylic thermally conductive interface pads with thermal conductivity up to 4.9 W/m-K. Pads are soft and conformable for easy handling, can be die cut, and available in thicknesses from 0.2mm to 2.0mm to fill large gaps.

3M thermally conductive interface tapes are used to bond heat sinks or other cooling devices to ICs, power transistors, or other components. Tapes are easy-to-use and offer excellent wet-out on most surfaces for effective thermal transfer, with thermal conductivity up to 1.5 W/m-k and tape thickness between 0.125mm to 0.50mm.

  • Thermally Conductive Interface Pads
    • Silicone: softer, allows higher temperatures
    • Acrylic: lower outgassing, lower cost
  • Pad Thermal Conductivity: up to 4.9 W/m-k
  • Pad Thickness: 0.2mm to 2.0mm
  • Tapes: easy-to-use and excellent wet-out
  • Tape Thermal Conductivity: up to 1.5 W/m-k
  • Tape Thickness: 0.125mm to 0.50mm

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