AVX Q-Bridge Thermal Conductor | New Product Brief
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
AVX Q-Bridge Thermal Conductor
ATC’s Q-Bridge Thermal Conductors allow designers to direct heat away from components and into a thermal ground plane, heat sink, or other thermal solution, reducing thermal hot spots and increasing circuit reliability.
Q-Bridge Thermal Conductors offer high thermal conductivity to readily move heat away from sensitive devices. The devices are constructed using aluminum nitride or beryllium oxide substrates that result in very low capacitance, making them nearly transparent in RF circuits. Q-Bridge Thermal Conductors are offered in EIA case sizes from 0302 to 3737, providing designers the flexibility to optimize for thermal performance and package size requirements.
Terminations are available with or without edge wrapping, and many configurations are available with silver platinum non-magnetic terminations.
- Thermal conductivity: up to 380mW/°C
- Substrate: AlN or BeO
- Low capacitance for transparency in RF circuits
- As low as 0.006pF
- Case sizes: 0302 to 3737
- Thickness: 20mils to 40mils
- Termination style: no wrap or edge wrap
- Termination materials: Silver Platinum Non-Magnetic or Silver over Magnetic Termination
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