Laird 60 Series Modules | New Product Brief
Laird 60 Series modules offer robust connectivity in any RF environment, providing reliable, lower power connections for medical devices, aerospace and industrial applications, and IoT bridging.
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Laird 60 Series Modules
Laird 60 Series modules offer robust connectivity in any RF environment, providing reliable, lower power connections for medical devices, aerospace and industrial applications, and IoT bridging. The modules are based on Marvell’s 88W8997 chipset and provide 802.11ac with 2x2 MU-MIMO and Bluetooth 4.2 on hardware that is Bluetooth 5 ready. 60 Series modules give designers the option to use a 14mm x 13mm SiP module or an M.2 2230-E module and are supported in Linux and Android. Both options offer Wi-Fi data rates up to 866.7 Mbps and global certifications. The M.2 module is based on the SIP module and offers two u.FL antenna connectors. Each module offers multiple host interface options, rapid roam for improved performance and reliability, and production test and calibration of the RF system.
- Chipset: Marvell 88W8997
- Wi-Fi: 802.11ac (Wave 2), 2x2 MU-MIMO
- Bluetooth 4.2 and Bluetooth 5 ready
- Form Factors: 14mm x 13mm SiP, M.2 2230-E
- Supported on Linux and Android
- Host Interface: SDIO, USB, PCIE (SiP only)
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