Intel FPGA Cloud Connectivity Kit | New Product Brief
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Terasic Technologies FPGA Cloud Connectivity Kit
Terasic Technologies FPGA Cloud Connectivity Kit integrates the rich versatility of an Intel® Cyclone® V SoC FPGA with cloud connectivity benefits. With both Wi-Fi® and BLUETOOTH® wireless communication, the FPGA Cloud Connectivity Kit is certified with key cloud service providers (CSPs) such as Microsoft Azure. Readily available open-source design examples take new users through the process of connecting an FPGA-based edge device to the cloud for the first time. The FPGA Cloud Connectivity Kit features a 2x20 GPIO header, a UART to USB interface as well as 2x6 TMD header. An integrated ambient light, temperature, and humidity sensors as well as a built-in 9-axis sensor with a magnetometer, accelerometer and gyroscope allow users to put a flexible and reconfigurable FPGA in a smart IoT edge design.
- FPGA Cloud Connectivity Kit
- DE10-Nano Cyclone V SoC FPGA board
- Cloud Connectivity
- RFS daughter card Interfaces
- UART to USB
- 2x6 TMD header
- 2x20 GPIO interface
- Wi-Fi: using ESP-WROOM-02 module, up to 100 meter range
- Bluetooth: using HC-05 module, up to 10 meter range
- Certified with key CSPs
- Open source design examples
- 9-axis sensor with accelerometer, gyroscope, and magnetometer
- Ambient light sensor
- Humidity and temperature sensor
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