Micron Multichip Packages | New Product Brief
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
Micron Multichip Packages
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package. MCPs are ideal for embedded IoT as they reduce the memory’s PCB footprint and BOM cost compared to discrete solutions. Offerings include NAND or eMMC paired with mobile LPDRAM, up to LPDDR4, in a broad range of densities and JEDEC-compliant package options, 1.8V MCPs are available for low-power applications.
All components are fabricated and rigorously tested by Micron to ensure high quality and high performance. MCPs are available with industrial and automotive temperate ratings; select MCPs are available with long product longevity commitments for products requiring long lifecycle support.
- MCP Options: SLC NAND+LPDDRx or e.MMC + LPDDRx
- LPDRAM up to LPDDR4
- JEDEC-compliant packages: FBGA, TFBGA, VFBGA, PoP
- Low Voltage: 1.8V MCPs ideal for low-power applications
- Industrial (-40°C to +85°C) and Automotive (-40°C to +105°C) temperature options
- Long-term support: 5-year+ product longevity commitments on select MCPs
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