This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
September 26, 2019 by Mouser Electronics
September 19, 2019 by Mouser Electronics
August 28, 2019 by Mouser Electronics
August 27, 2019 by Mouser Electronics
Discover TE's cost-saving connectivity solution for 5G wireless designs.
July 30, 2019 by Mouser Electronics
These low-profile, narrow width connectors are ideal for a range of applications.
July 25, 2019 by TTI, Inc
This series takes heat release in a different direction than other traditional heatsinks.
July 12, 2019 by TTI, Inc
NXP Semiconductor’s i.MX Mini Evaluation Kit is a high performance, high-efficiency development platform for media-rich industrial and commercial applications.
June 06, 2019 by Mouser Electronics
Amphenol SV Microwave LiteTouch solderless PCB connectors are compression mount connectors that won’t damage underlying traces.
May 29, 2019 by Mouser Electronics
Microchip Technology’s dsPIC33CH Curiosity Development Board is a flexible platform for developing with Microchip’s dsPIC33CH family of dual-core digital signal controllers.
May 28, 2019 by Mouser Electronics
Analog Devices’ DC2609A is a demonstration and evaluation platform for the LTC6952 ultralow jitter 4.5GHz PLL.
May 17, 2019 by Mouser Electronics
The LPC series offers a 7.62mm pitch with up to 6 positions rated at 41A and 1000V, and the LPCH series adds 6 signal contacts for up to 8A and 160V and eliminates the need for individual connectors.
May 09, 2019 by TTI, Inc
Minitek's 2.00mm modular connectors can save up to 38% of PCB space and functions as a complete connector system for board-to-board and cable or wire-to-board connections.
May 03, 2019 by TTI, Inc
Microchip Technology’s PIC-IoT WG Development Board is a plug-and-play device that makes it easy to securely connect to the Google Cloud IoT Platform.
April 18, 2019 by Mouser Electronics
FINEPITCH connectors, available with a 0.8 or a 1.27 millimeter pitch, have a long wipe length to address a wide range of stack heights, and the housing design permits a large compensation tolerance.
April 18, 2019 by TTI, Inc
Bourns 2019 Series GDT Surge Arrestors use Bourns’ FLAT technology to enable a high current rating in a low-profile package that offers significant height and volume savings over equivalent 8mm SMD GDTs.
April 15, 2019 by Mouser Electronics
Renesas Electronics’ RTK-251-1PowerBank3 is a reference board for a 3 cell lithium ion battery power bank based on a Renesas USB Power Delivery Controller and a Buck-Boost NVDC charger.
April 12, 2019 by Mouser Electronics
Cinch CIN::APSE Solderless Stacking Connectors use an innovative z-axis compression contact that provides excellent mechanical and electrical performance.
April 10, 2019 by Mouser Electronics
Microchip’s SAMA5D2 Xplained Ultra evaluation kit is a fast prototyping and development platform for the SAMA5D2 series of microprocessors.
April 08, 2019 by All About Circuits
TE Connectivity offers custom antennas using MID technology and either laser direct structuring or two-shot molding.
March 28, 2019 by TTI, Inc
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