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NXP Semiconductors LPC54018 IoT Module (OM40007) | New Product Brief

NXP Semiconductors LPC54018 IoT Module (OM40007) | New Product Brief

NXP’s LPC54018 IoT Module is a high-performance MCU module designed for developing with Amazon’s FreeRTOS and other IoT platforms.


Harting MICA IIoT Starter Kits | New Product Brief

Harting MICA IIoT Starter Kits | New Product Brief

Harting MICA IIoT Starter Kits are modular edge computing devices for the industrial IoT.


Semtech SX1261 Development Kit | New Product Brief

Semtech SX1261 Development Kit | New Product Brief

Semtech SX1261 development kits are based on Semtech’s SX1261 low-power, long-range LoRa transceivers for many IoT applications, including smart cities, building automation, agriculture, and healthcare applications.


Skyworks Solutions IoT Front End Modules | New Product Brief

Skyworks Solutions IoT Front End Modules | New Product Brief

Skyworks’ SKY66119 is a 460 MHz transmit/receive front-end module that provides high performance and a simpler design for a variety of applications.


NXP Semiconductors Rapid IoT Prototyping Kit | New Product Brief

NXP Semiconductors Rapid IoT Prototyping Kit | New Product Brief

NXP’s Rapid IoT Prototyping Kit integrates a powerful MCU, wireless connectivity, security, and multiple sensors in a compact, user-friendly modular package.


Maxim Integrated DARWIN Family of Ultralow Power Processors | New Product Brief

Maxim Integrated DARWIN Family of Ultralow Power Processors | New Product Brief

Maxim DARWIN MCUs combine deep memory, power efficiency, and security to enable smart IoT products.


Molex Triple Band (900MHz) Wi-Fi Antenna | Tech Specs

Molex Triple Band (900MHz) Wi-Fi Antenna | Tech Specs

Molex Series 201932 Triple-band Wi-Fi ceramic antennas cover all three Wi-Fi bands, 900 MHz, 2.4 GHz, and 5 GHz, providing designers a single solution to connect their devices to Wi-Fi networks on any band.


New Products May 15, 2018 by TTI, Inc
Nordic Semiconductor nRF52840 Multi-Protocol SoC | New Product Brief

Nordic Semiconductor nRF52840 Multi-Protocol SoC | New Product Brief

Nordic Semiconductor’s nRF52840 Multi-Protocol SoC is an ultra-low power, highly flexible SoC for short-range wireless applications, including advanced wearables, IoT devices, advanced remote controls, and gaming controllers.


Skyworks Solutions Inc. SKY66114 IoT Front-End Modules | New Product Brief

Skyworks Solutions Inc. SKY66114 IoT Front-End Modules | New Product Brief

Skyworks’ SKY66114 is a fully integrated 2.4 GHz front-end module for Bluetooth Low Energy, 802.15.4, and ZigBee, making it easy to implement wireless communications in IoT applications.


Digi XBee 3 ZigBee 3.0 RF Modules | New Product Brief

Digi XBee 3 ZigBee 3.0 RF Modules | New Product Brief

Digi International’s XBee3 ZigBee 3.0 RF modules are small, efficient, and secure modules that offer programmability to create smart IoT nodes.


Maxim Integrated DS28E38 DeepCover Secure ECDSA Authenticator | Featured Product Spotlight

Maxim Integrated DS28E38 DeepCover Secure ECDSA Authenticator | Featured Product Spotlight

Maxim's DS28E38 Deep Cover Secure ECDSA Authenticators integrate Maxim's ChipDNA PUF technology and offer robust, effective protection against security attacks.


Microchip SAM L Series Microcontrollers | Featured Product Spotlight

Microchip SAM L Series Microcontrollers | Featured Product Spotlight

Microchip's SAM L Series MCUs are ultra-low-power Arm Cortex-M0+ based MCUs that are designed specifically for IoT and to enable applications with a battery life of 10 or more years.


Terasic Technologies DE-10 Nano Development Kit | Featured Product Spotlight

Terasic Technologies DE-10 Nano Development Kit | Featured Product Spotlight

The Terasic Technologies DE-10 Nano Development Kit is based on the Intel® Cyclone V SoC and provides extensive connectivity and expandability to leverage the capabilities of the Cyclone V SoC.


Texas Instruments PGA460 Signal Processor and Transducer SoC | Featured Product Spotlight

Texas Instruments PGA460 Signal Processor and Transducer SoC | Featured Product Spotlight

TI’s PGA460 is a highly integrated ultrasonic signal processor and transducer SoC that can be used for object detection and distance sensing in automotive, drone, IoT, and industrial applications, with the flexibility to be used in transformer-based or direct drive topologies for transducer excitation.


ON Semiconductor RSL10 BLE Radio SoC | Featured Product Spotlight

ON Semiconductor RSL10 BLE Radio SoC | Featured Product Spotlight

ON Semiconductor’s RSL10 is the industry’s lowest power BLE radio SoC, with the lowest power consumption in peak receiving and deep sleep modes.


Laird 60 Series Modules | New Product Brief

Laird 60 Series Modules | New Product Brief

Laird 60 Series modules offer robust connectivity in any RF environment, providing reliable, lower power connections for medical devices, aerospace and industrial applications, and IoT bridging.


TI CC3120 SimpleLink Wireless Network Processor | Featured Product Spotlight

TI CC3120 SimpleLink Wireless Network Processor | Featured Product Spotlight

TI's CC3120 SimpleLink Wireless Network Processor uses a dedicated ARM Cortex-M3 MCU with Wi-Fi and Internet protocols implemented in ROM, and it can be used with nearly any host MCU to handle all aspects of Wi-Fi functionality.


Microsemi PolarFire Evaluation Kit | New Product Brief

Microsemi PolarFire Evaluation Kit | New Product Brief

Microsemi’s PolarFire Evaluation Kit is a high performance platform for high speed interface evaluation with the low power, cost-optimized PolarFire FPGAs.


NXP Kinetis K27 and K28 | Featured Product Spotlight

NXP Kinetis K27 and K28 | Featured Product Spotlight

NXP's Kinetis K27 and K28 Family of MCUs are based on a 150 MHz ARM Cortex-M4 with floating point unit and offer the highest available SRAM and low system power.


Bosch Sensortec BME680 | New Product Brief

Bosch Sensortec BME680 | New Product Brief

Bosch Sensortec’s BME680 combines gas, air pressure, humidity, and ambient temperature sensing into a small, low-cost, and low power package for IoT, mobile, and wearable devices.