This project brief describes how to assemble an isolated half-bridge IGBT gate driver module built around the NCD57085DR2G. It features onboard current sensing and overcurrent protection.
In this article, we analyze how bandpass filtering affects the power spectral density (PSD) of noise and explore how noise can be described by in-phase and quadrature components.
Learn what Matter is, how it enables interoperability across smart home devices, and how Silicon Labs' development tools and support can help accelerate Matter-enabled product design.
Register now for your chance to win an STM32 Nucleo-64 development board from STMicroelectronics and Avnet SILICA.
Learn how a chipset's specs and features impact the RF performance of IoT end devices so you know what is "good enough" for your IoT products. Watch Silicon Labs' on-demand webinar.
The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.
The new chipset targets CUDIMM, CQDIMM, and CSODIMM modules for AI PC desktops and laptops.
Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level…
France’s Électronique 2030 program commits €5B+ to revitalize its semiconductor industry. Learn the details of this ambitious effort, and the market…
This article explores the advantages of using both radar and camera systems in the cabin of a vehicle. It also gives some ideas as to what all-in-one solutions…
ST recently introduced the L9963F battery-management IC for EVs and energy storage systems with ASIL-D support and synchronized cell monitoring.
This project brief explains how to construct a PCB-based audio-processing platform with an ATmega328 microcontroller. A link to Arduino code for creating an…
Two new CoolGaN BDS additions replace back-to-back silicon MOSFET pairs with chip-scale packages.