TE Connectivity offers custom antennas using MID technology and either laser direct structuring or two-shot molding.
TE Connectivity offers custom antennas using MID technology and either laser direct structuring or two-shot molding.
Infineon’s XENSIV sensor portfolio enables designers to add more intelligence to devices, enabling them to truly…
Infineon’s XENSIV sensor portfolio enables designers to add more intelligence to devices, enabling them to truly understand their environment.
ON Semiconductor IoT Prototyping Platforms are a set of configurable, end-to-end, rapid prototyping platforms covering a…
ON Semiconductor IoT Prototyping Platforms are a set of configurable, end-to-end, rapid prototyping platforms covering a wide range of IoT applications.
Renesas Electronics’ TB-S1JA Synergy Target Board is a development and evaluation board for the S1JA Synergy MCU group.
Renesas Electronics’ TB-S1JA Synergy Target Board is a development and evaluation board for the S1JA Synergy MCU group.
TE Connectivity’s M12 PCB/Panel connectors provide a quick, reliable connection that mounts directly onto PCBs and…
TE Connectivity’s M12 PCB/Panel connectors provide a quick, reliable connection that mounts directly onto PCBs and panels, ideal for applications such as industrial automation, machinery, and vision systems.
Riedon shunts enable accurate current measurement in a wide range of applications, such as renewable energy, RVs, and…
Riedon shunts enable accurate current measurement in a wide range of applications, such as renewable energy, RVs, and marine power supplies.
Harwin’s M225 series of 2mm pitch high-performance connectors are designed for automated crimping to reduce…
Harwin’s M225 series of 2mm pitch high-performance connectors are designed for automated crimping to reduce installation costs and offer a reliable connection under high levels of shock.
Phoenix Contact FINEPITCH Board-to-Board Connectors are robust and versatile high-density connectors for use in…
Phoenix Contact FINEPITCH Board-to-Board Connectors are robust and versatile high-density connectors for use in industrial automation, such as I/Os, PLCs, frequency converters, and HMIs.
Toshiba’s CUHS10F60 Schottky Barrier Diode is designed for high-speed switching applications with high breakdown…
Toshiba’s CUHS10F60 Schottky Barrier Diode is designed for high-speed switching applications with high breakdown voltage and low reverse current.
Digi International’s WR54 cellular routers provide dual redundant communication for mission-critical transportation and…
Digi International’s WR54 cellular routers provide dual redundant communication for mission-critical transportation and industrial applications.
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.
NXP S32K EVB evaluation boards can be used for quick prototyping and demonstration of applications using the S32K116 and…
NXP S32K EVB evaluation boards can be used for quick prototyping and demonstration of applications using the S32K116 and S32K118 MCUs.
ISI offers BGA reballing that includes removing the lead-free solder balls, then attaching eutectic tin-lead solder balls…
ISI offers BGA reballing that includes removing the lead-free solder balls, then attaching eutectic tin-lead solder balls or other special solder ball alloys.
STMicroelectronics STM32G0 32-bit MCUs are cost-effective MCUs for consumer and industrial applications.
STMicroelectronics STM32G0 32-bit MCUs are cost-effective MCUs for consumer and industrial applications.
Taiyo Yuden’s EYSLSNZWW Bluetooth Low Energy 5.0 Module provides wireless connectivity and advanced processing in a…
Taiyo Yuden’s EYSLSNZWW Bluetooth Low Energy 5.0 Module provides wireless connectivity and advanced processing in a compact package ideal for wearables and IoT devices.
RECOM Power RPM Low-Profile DC/DC Converters are compact, high density power modules for use in IoT, Industry 4.0, and…
RECOM Power RPM Low-Profile DC/DC Converters are compact, high density power modules for use in IoT, Industry 4.0, and Point-of-Load applications.
AVX 9176-800 series IDC connectors are ideal for space-constrained, harsh environment applications requiring a robust…
AVX 9176-800 series IDC connectors are ideal for space-constrained, harsh environment applications requiring a robust wire-to-board termination for signal and power.
Hirose Electric ER8 Board-to-Board connectors are robust and compact high-speed connectors for use in applications…
Hirose Electric ER8 Board-to-Board connectors are robust and compact high-speed connectors for use in applications including commercial devices, motor control, medical equipment, and industrial machinery.
Texas Instruments’ TAS5805MEVM audio amplifier evaluation module is based on the TAS5805M, a digital input, closed-loop…
Texas Instruments’ TAS5805MEVM audio amplifier evaluation module is based on the TAS5805M, a digital input, closed-loop Class D audio amplifier.
TE Connectivity’s AmbiMate MS4 sensor module has sensors for motion, light, temperature, and humidity.
TE Connectivity’s AmbiMate MS4 sensor module has sensors for motion, light, temperature, and humidity.
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