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PCB Modularity — Reuse and Scale

PCB Modularity — Reuse and Scale

This eBook explores how PCB designers can move from one-off designs to scalable systems by rethinking schematics, embracing abstraction, and designing for reuse. Whether you’re an engineer, team lead, or hardware innovator, download this guide to help you design with flexibility, speed, and longevity in mind.


Power Integration Challenges in Medical Devices

Power Integration Challenges in Medical Devices

Discover how to overcome power integration challenges in medical device design—download our white paper for expert insights and practical solutions.


OSM Open Standard Module™ Design Guide

OSM Open Standard Module™ Design Guide

Discover how modular embedded design, powered by MediaTek Genio 510, can power smarter, more connected coffee machines for next-generation appliance development.


Measurement of Residual Phase Noise of Amplifiers at 80 GHz Using Interferometric Measurement Technique

Measurement of Residual Phase Noise of Amplifiers at 80 GHz Using Interferometric Measurement Technique

Learn how to measure residual phase noise of amplifiers at 80 GHz using a simple interferometric method and improve your testing accuracy today.


Next-Level Power Density in Solar and Energy Storage With Silicon Carbide MOSFETs

Next-Level Power Density in Solar and Energy Storage With Silicon Carbide MOSFETs

Download Infineon’s white paper to discover how next-generation silicon carbide MOSFETs unlock higher power density, efficiency, and cost savings in solar and energy storage systems.


Powering Medical Devices with Confidence

Powering Medical Devices with Confidence

The right power supply can make or break IEC 60601-1 compliance. Our new eBook explains what engineers need to know about leakage current, isolation, and global approvals, with practical tips to streamline design.


Smarter Factories with Edge AI Vision: How ADLINK and NXP Improved Yield and Reliability

Smarter Factories with Edge AI Vision: How ADLINK and NXP Improved Yield and Reliability

Discover how NXP and ADLINK boosted semiconductor yield and enabled predictive maintenance with edge AI vision.


High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

Winbond’s W25QxxRV NOR Flash memory is currently available in densities ranging from 1Mb to 32Mb, with higher densities set to be launched soon. The RV family offers low power consumption, a compact form factor, and supports industrial temperatures up to 105°C, making it suitable for various markets and applications.


A New Approach to Load Pull

A New Approach to Load Pull

With increasing signal bandwidths, modulated signals are being used more and more in load pull environments. In this paper, we look at use-cases and a new method to run load pull testing with modulated signals.


From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

Download the white paper to discover how real-time edge AI is transforming retail analytics with privacy-first, scalable insights.


Driving Fuel Cell Advancement with Programmable Power Solutions

Driving Fuel Cell Advancement with Programmable Power Solutions

Power the hydrogen fuel cells' future with advanced programmable power systems. From green hydrogen production and fuel cell EV testing to real-world energy simulations—see how AMETEK solutions are accelerating innovation across the hydrogen ecosystem.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


Why Manual Engineering Processes Are Costing Your Company More Than You Think

Why Manual Engineering Processes Are Costing Your Company More Than You Think

Discover the true price of outdated workflows and how digital transformation can unlock your team's potential.


New Components Enhance Efficiency and Reliability of Transportation Equipment

New Components Enhance Efficiency and Reliability of Transportation Equipment

Access this new technical paper where Panasonic Industry experts share how the latest capacitors, inductors, materials, connectors, switches, and resistors are boosting performance and enabling the next generation of transportation.


Enabling Emotion Detection in AI Using High-SNR MEMS Devices

Enabling Emotion Detection in AI Using High-SNR MEMS Devices

Explore the journey of sound recording, from Fantasia’s orchestra to MEMS microphones, and see how AI is shaping the future of audio clarity.


Rugged & Reliable Connectivity Solutions for Harsh Environments from Avnet Abacus and Molex

Rugged & Reliable Connectivity Solutions for Harsh Environments from Avnet Abacus and Molex

Designing electronics for harsh conditions? Molex and Avnet Abacus provide rugged connectivity solutions engineered for automotive, commercial vehicle, and off-road applications where sealing, vibration resistance, and EMI shielding must not fail.


Calibre Vision AI: A Revolution in Chip-Level DRC Debug Using AI-Guided Results Analysis

Calibre Vision AI: A Revolution in Chip-Level DRC Debug Using AI-Guided Results Analysis

Download the white paper to see how Calibre Vision AI transforms DRC debug with AI-driven insights, faster analysis, and smarter error resolution.


Edge AI for Audio: Trends, Use Cases, and Predictions

Edge AI for Audio: Trends, Use Cases, and Predictions

Learn how the Music AI Embedded SDK empowers product teams to run near-real-time stem separation directly on embedded hardware.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


Rugged by Design: PCB Design for Harsh Environments

Rugged by Design: PCB Design for Harsh Environments

PCBs often face extreme conditions such as heat, vibration, moisture, and electromagnetic interference. Summit Interconnect's "Designing PCBs for Harsh Environments Guide" provides practical strategies to help engineers protect their designs and ensure long-term reliability.