This white paper from Infineon Technologies discusses how PoE is enabling smarter buildings, the selection process for an optimum approach for the PSE SMPS, options for a standard PD-side SMPS, and the application-specific PoE needs in regards to powering LED lighting.
August 26, 2021 by Infineon Technologies
This white paper describes the basic components of the Tessent Streaming Scan Network (SSN), a technology designed to decouple core level and chip level DFT requirements. With SSN, DFT engineers can for the first time implement DFT using a true, effective bottom-up flow, not having to make trade-offs between implementation effort and manufacturing test cost.
June 17, 2021 by Siemens Digital Industries Software
%, dB, dBm and dB (µV/m) are important concepts that every engineer should understand in his (or her) sleep. Because if he does not, he is bound to be at a disadvantage in his work.
May 06, 2021 by Rohde & Schwarz
One thing is clear — tapeouts are getting harder and taking longer. According to statistics from industry conference surveys, at least 50% of scheduled tapeouts slip each year.
March 30, 2021 by Siemens Digital Industries Software
Accurately extracting and calculating the common resistance of interconnects within analog IC designs is fundamental for evaluating circuit reliability, particularly for noise and voltage drop analysis and ESD protection verification.
March 30, 2021 by Siemens Digital Industries Software
The next generation of all kinds of devices will rely heavily on new iterations of Wi-Fi technology, which will be more powerful, efficient, and complex than ever before. These developments and advancements will enable more connected homes, offices, and factories.
March 25, 2021 by Rohde & Schwarz
Tuning microwave filters requires specialized technicians, which can be very expensive and time-consuming. Using a tool that enables non-specialized technicians to perform this task could be the key to accelerating design and manufacturing processes while still maintaining high-quality performance.
March 24, 2021 by Rohde & Schwarz
Early chip-level physical verification faces many challenges. The Calibre™ Recon tool enables design teams to perform analysis and physical verification of full-chip design layouts during the very early stages of the design cycle, while the different components are still immature.
March 23, 2021 by Siemens Digital Industries Software
5G capabilities cover many different applications, standards, and capabilities. Enhanced mobile broadband (eMBB), massive machine type communications (mMTC), and ultra-reliable low latency communications (URLLC) all contribute to the extended coverage and never-before-seen reliability with unparalleled accessibility.
March 23, 2021 by Rohde & Schwarz
