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The Myriad of Display Options Can Pose Challenges to Selecting the Right Solution for your HMI

Displays for HMI solutions.

January 09, 2023 by SCHURTER

The Future of Energy Efficient Technologies

Infineon and All About Circuits have collaborated to produce an eBook focused on the future of energy efficient technologies. This eBook goes deeper into the analysis of microgrid energy management systems, the modern approach to the electrification of outdoor power tools, microelectronics, smart homes and buildings, and solar inverter designs.

December 19, 2022 by Infineon Technologies

Designing embedded applications that require high power and additional control capability

Make the most of EZ-PD™ PMG1-S3, a high-voltage MCU for USB-PD 3.1 EPR up to 140 W.

December 13, 2022 by Infineon Technologies

EZ-PD™ PMG1 high voltage MCU as a coprocessor for embedded applications

Building multiprocessor system solutions for system and power management.

December 13, 2022 by Infineon Technologies

EZ-PD™ PMG1 high voltage MCU with integrated buck/boost controller for battery powered applications

Make the most of EZ-PD™ PMG1-B1, a high-voltage MCU for USB-PD with an integrated buck-boost battery charge controller.

December 13, 2022 by Infineon Technologies

A Better Way to Prototype RF Designs, Using X-Microwave

Prototyping is a headache well known in the RF engineering world—the solution to faster, easier, and more accurate prototypes is X-Microwave.

November 23, 2022 by Analog Devices

How to Design a Programmable Gain Instrumentation Amplifier for Precision Wide Bandwidth Signal Chains

Design wide bandwidth programmable gain instrumentation amplifiers (PGIAs).

November 04, 2022 by Analog Devices

EMC Basics: Using EMI Filters

EMI filters help ensure an EMI-compliant design.

October 20, 2022 by Würth Elektronik

Know Your Jitter When Debugging

This white paper is designed to provide you with a toolbox on how to look for, assess, and address jitter in your signal verification tasks. You will find real-world scenarios, recommended test and measurement solutions and more – all in a bite-sized format.

September 28, 2022 by Rohde & Schwarz

IoT Opens Door to Driverless Control of Data Acquisition Hardware

Help save time and money when setting up a data acquisition system.

September 09, 2022 by AMETEK Programmable Power

Why Wi-Fi 6 goes hand-in-hand with cellular to enable the hyper-connected enterprise future

Wi-Fi 6 is increasingly seen as a complementary to cellular technologies.

September 01, 2022 by Quectel

Accelerate IoT device time-to-market by combining antennas and modules

Alongside connectivity and power, a third area – the antenna – needs to be given equal attention because of the fundamental impact it has on device performance.

September 01, 2022 by Quectel

Addressing the Challenges of Specifying and Making Power Racks

Explore the common challenges faced by engineers when employing power racks and how EA Elektro-Automatik’s turnkey solutions provide a safe, user-friendly alternative to custom designs.

August 30, 2022 by EA Elektro-Automatik

Design with EMI in Mind: Test Early, Test Often

Download this poster to help design with EMI in mind.

August 29, 2022 by Rohde & Schwarz

Four Key Features of Omron Tactile Switches

Selecting the right tactile switch is important for providing a quality user interface for industrial, consumer, and white good applications.

August 27, 2022 by Omron

Fundamentals of THz Technology for 6G

Learn about the fundamentals of THz waves and their properties, the key performance requirements, and the respective research areas.

August 25, 2022 by Rohde & Schwarz

Meeting the Demand for Smaller and More Reliable Power Modules with the X Series RC-IGBTs

Explore the advantages of the next generation in IGBT technology and how this benefits industrial and automotive applications.

August 24, 2022 by Fuji Electric

EMC Standards - Overview 5.0

The number of EMC standards published is steadily increasing. In this white paper by Rohde & Schwarz, explore basic standards, generic standards, and product/product family standards.

August 15, 2022 by Rohde & Schwarz

Deliver 3D IC Innovations Faster

Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.

July 26, 2022 by Siemens Digital Industries Software

System-level Connectivity Management and Verification of 3D IC Heterogeneous Assemblies

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.

July 26, 2022 by Siemens Digital Industries Software