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Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Access Panasonic’s whitepaper to optimize your component choices and build a stronger foundation for the future of medtech.


Guide to Requirements Management for Modern Electronics Teams

Guide to Requirements Management for Modern Electronics Teams

Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and tools for modern requirements management to help teams reduce errors, improve collaboration, and accelerate delivery.


OSM Open Standard Module™ Design Guide

OSM Open Standard Module™ Design Guide

Discover how modular embedded design, powered by MediaTek Genio 510, can power smarter, more connected coffee machines for next-generation appliance development.


High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

Winbond’s W25QxxRV NOR Flash memory is currently available in densities ranging from 1Mb to 32Mb, with higher densities set to be launched soon. The RV family offers low power consumption, a compact form factor, and supports industrial temperatures up to 105°C, making it suitable for various markets and applications.


From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

Download the white paper to discover how real-time edge AI is transforming retail analytics with privacy-first, scalable insights.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Winbond's TrustME® W77Q Secure Flash Memory provides an efficient, cost-effective, and easy-to-integrate solution for achieving compliance with NIST 800-193. By leveraging W77Q, system designers can enhance security, reduce development costs, and accelerate time-to-market, ensuring that their products remain resilient against future cyber threats.


Why Compact, Cost-Effective Wi-Fi Modules Are Critical Components for Smart Lighting Mega-Growth

Why Compact, Cost-Effective Wi-Fi Modules Are Critical Components for Smart Lighting Mega-Growth

Smart lighting is a fast-growing market fueled by the shift to energy-efficient LEDs and growing demand for connected home solutions, with Wi-Fi emerging as the leading connectivity option. As affordable, app-controlled smart bulbs gain popularity and older LEDs are replaced, compact and reliable Wi-Fi modules are essential to sustaining this growth. Read the full white paper to discover how your business can stay ahead in this evolving market.


Automated Compliance Test Solution for High Speed Ethernet Cables

Automated Compliance Test Solution for High Speed Ethernet Cables

Discover a faster, more reliable way to perform high-speed cable compliance testing with an automation suite. Reduce test time, eliminate manual errors, and get precise pass/fail results—engineered for efficiency and accuracy.


A Quick Guide to Wire Bonding

A Quick Guide to Wire Bonding

Wire bonding is the backbone of high-performance, compact electronics—powering everything from advanced sensors to high-density semiconductors. Don’t miss our latest white paper to discover how Altium Designer 25’s cutting-edge Wire Bonding feature can transform your PCB designs and keep you ahead of the curve!


SiC Cascode JFETs: Easing the Transition from Silicon to Silicon Carbide

SiC Cascode JFETs: Easing the Transition from Silicon to Silicon Carbide

This white paper explores the advantages of SiC devices with an examination of onsemi’s EliteSiC Cascode JFETs. They combine a SiC JFET with a Si MOSFET to create a normally-off device that simplifies the transition from silicon to silicon carbide while maintaining compatibility with standard Si gate drivers. These devices offer key advantages such as ultra-low RDS(ON), reduced capacitance for faster switching, and improved reliability by eliminating gate oxide concerns.


A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

Discover how to speed up your design process without sacrificing accuracy using advanced electromagnetic analysis techniques.


System Solutions Guide: Drones

System Solutions Guide: Drones

Drones have evolved from basic remote-controlled devices to advanced machines with sophisticated sensors, GPS, and autonomous navigation. This solutions guide explores how technologies such as high-resolution cameras, depth-sensing systems, and AI enhance drones' capabilities in performing complex tasks like obstacle avoidance, real-time data analysis, and advanced navigation. It includes block diagrams, recommended image sensor devices, and development tool information to assist in designing next-gen drone systems.


Delivering Efficient Power Control with Discrete Gallium Nitride (GaN) Devices

Delivering Efficient Power Control with Discrete Gallium Nitride (GaN) Devices

The world is increasingly relying on electric power—from the devices in our hands and homes to the shift toward green transportation. Within this, it is critical to ensure that the correct amount and type of power are delivered safely, efficiently, and as intended.


The Fundamentals of Electromagnetic Compliance

The Fundamentals of Electromagnetic Compliance

Learn how EMI mitigation techniques in design and testing can enhance electromagnetic compliance by addressing signal and noise interactions in electronic environments.


Switching Analysis: Testing for Reliability in Power Converter Designs

Switching Analysis: Testing for Reliability in Power Converter Designs

Discover essential reliability testing methods for power converter designs in safety-critical industries like automotive, aerospace, and defense.


Fundamentals of THz Technology for 6G

Fundamentals of THz Technology for 6G

Learn about the fundamentals of THz waves and their properties, the key performance requirements, and the respective research areas.


Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

RIGOL App Note shows how to use oscilloscopes to test long term signal quality characteristics including jitter and eye patterns without investing in high performance, high cost solutions. Download to learn more about Advanced Embedded Systems Debug.


Wi-Fi 7 Technology Introduction

Wi-Fi 7 Technology Introduction

IEEE 802.11be (Wi-Fi 7) offers extremely high throughput, lower latency, and higher reliability, with advancements like wider bandwidths and multi-link operation. Explore the key technologies and testing challenges in this comprehensive white paper.