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Streamlining Design-to-Manufacture for Imaging Devices Tutorial

Streamlining Design-to-Manufacture for Imaging Devices Tutorial

In this tutorial, we introduce onsemi’s PRISM platform, a pre-optimized reference imaging solution that streamlines camera design by integrating sensors, optics, interfaces, and image processing. It explains how PRISM simplifies system integration through standardized modules, tuned ISP configurations, and validated performance testing using components like the AP1302 co-processor and Demo3 evaluation platform. The tutorial also highlights PRISM’s support for Hyperlux CMOS image sensors and its broad processor ecosystem compatibility.


Setting New Performance Standards with IEEE 802.11bn

Setting New Performance Standards with IEEE 802.11bn

Wi-Fi 8 (IEEE 802.11bn) pushes wireless performance to the next level with major gains in throughput, latency and reliability — especially for dense networks and real-time applications. This white paper breaks down the key PHY and MAC enhancements and what they mean for next-gen device and AP testing.


Choose an End-To-End IoT Solutions Provider to Reduce Complexity, Enhance Innovation, Cut Costs, Gain Flexibility and Achieve a Faster Time-To-Market

Choose an End-To-End IoT Solutions Provider to Reduce Complexity, Enhance Innovation, Cut Costs, Gain Flexibility and Achieve a Faster Time-To-Market

The IoT market is growing quickly, but increasing device complexity, global compliance needs, and challenges in managing software, hardware, testing, and security make deployment difficult. End-to-end providers like Quectel streamline this process by delivering integrated modules, antennas, hardware design, software, and manufacturing support to reduce risk and speed time-to-market. Their comprehensive ecosystem offers expert guidance, smoother project management, and access to global resources.


Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

This white paper explores the importance of power integrity in PCB design and demonstrates how the Power Analyzer by Keysight, integrated with Altium Designer, helps engineers identify and resolve voltage drop and current density issues early in the design process.


New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

Download the white paper to see how the new COM Express® mini modules deliver maximum Intel® Core™ performance in ultra-compact, rugged edge-computing designs.


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Discover how Winbond’s low-power memory and Customized Memory Solutions (CMS) advance sustainable, high-performance design for AI, automotive, and industrial applications. Download the white paper to learn more.


Advanced Programmable Power Supply Features Boost Productivity

Advanced Programmable Power Supply Features Boost Productivity

Learn how cutting-edge advanced programmable power supplies enhance productivity with remote control, regenerative capabilities, and high-frequency options. Download this AMETEK Programmable Power's White Paper Today!


Digital Thread for Electronics: Synchronizing PCB, Multi-Board, and Harness Design

Digital Thread for Electronics: Synchronizing PCB, Multi-Board, and Harness Design

Discover how a unified digital thread connects PCB, multi-board, and harness design into one synchronized workflow. Learn how integrated data and real-time collaboration help teams eliminate errors and accelerate system development.


Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Access Panasonic’s whitepaper to optimize your component choices and build a stronger foundation for the future of medtech.


Guide to Requirements Management for Modern Electronics Teams

Guide to Requirements Management for Modern Electronics Teams

Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and tools for modern requirements management to help teams reduce errors, improve collaboration, and accelerate delivery.


OSM Open Standard Module™ Design Guide

OSM Open Standard Module™ Design Guide

Discover how modular embedded design, powered by MediaTek Genio 510, can power smarter, more connected coffee machines for next-generation appliance development.


High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

High Performance, Low Power, Small Form-factor Flash Memory for Next Generation Devices

Winbond’s W25QxxRV NOR Flash memory is currently available in densities ranging from 1Mb to 32Mb, with higher densities set to be launched soon. The RV family offers low power consumption, a compact form factor, and supports industrial temperatures up to 105°C, making it suitable for various markets and applications.


From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

Download the white paper to discover how real-time edge AI is transforming retail analytics with privacy-first, scalable insights.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Winbond's TrustME® W77Q Secure Flash Memory provides an efficient, cost-effective, and easy-to-integrate solution for achieving compliance with NIST 800-193. By leveraging W77Q, system designers can enhance security, reduce development costs, and accelerate time-to-market, ensuring that their products remain resilient against future cyber threats.


Why Compact, Cost-Effective Wi-Fi Modules Are Critical Components for Smart Lighting Mega-Growth

Why Compact, Cost-Effective Wi-Fi Modules Are Critical Components for Smart Lighting Mega-Growth

Smart lighting is a fast-growing market fueled by the shift to energy-efficient LEDs and growing demand for connected home solutions, with Wi-Fi emerging as the leading connectivity option. As affordable, app-controlled smart bulbs gain popularity and older LEDs are replaced, compact and reliable Wi-Fi modules are essential to sustaining this growth. Read the full white paper to discover how your business can stay ahead in this evolving market.


Automated Compliance Test Solution for High Speed Ethernet Cables

Automated Compliance Test Solution for High Speed Ethernet Cables

Discover a faster, more reliable way to perform high-speed cable compliance testing with an automation suite. Reduce test time, eliminate manual errors, and get precise pass/fail results—engineered for efficiency and accuracy.


A Quick Guide to Wire Bonding

A Quick Guide to Wire Bonding

Wire bonding is the backbone of high-performance, compact electronics—powering everything from advanced sensors to high-density semiconductors. Don’t miss our latest white paper to discover how Altium Designer 25’s cutting-edge Wire Bonding feature can transform your PCB designs and keep you ahead of the curve!


SiC Cascode JFETs: Easing the Transition from Silicon to Silicon Carbide

SiC Cascode JFETs: Easing the Transition from Silicon to Silicon Carbide

This white paper explores the advantages of SiC devices with an examination of onsemi’s EliteSiC Cascode JFETs. They combine a SiC JFET with a Si MOSFET to create a normally-off device that simplifies the transition from silicon to silicon carbide while maintaining compatibility with standard Si gate drivers. These devices offer key advantages such as ultra-low RDS(ON), reduced capacitance for faster switching, and improved reliability by eliminating gate oxide concerns.