Embedded FPGA (eFPGA) puts a block of programmable logic on the same die as an automotive SoC's CPU, memory, and analog, so hardware accelerators needed for…
Embedded FPGA (eFPGA) puts a block of programmable logic on the same die as an automotive SoC's CPU, memory, and analog, so hardware accelerators needed for radar, battery management, motor control, and security can be updated in the field with a secure bitstream instead of a year-long, multimillion-dollar respin and requalification of the silicon. Here's where it pays for its area, and where it doesn't.
eFPGA integration doesn’t have to be a schedule risk. When embedded FPGA IP is delivered as a hardened macro, with…
eFPGA integration doesn’t have to be a schedule risk. When embedded FPGA IP is delivered as a hardened macro, with standard EDA views, a reference integration flow, defined ownership, deterministic bitstream loading, and explicit sign-off criteria, the extra integration work the NSA flagged becomes a bounded, repeatable work package rather than an open-ended unknown.
As chip architecture evolves toward heterogeneous SoCs and chiplets, engineers face a growing challenge: balancing…
As chip architecture evolves toward heterogeneous SoCs and chiplets, engineers face a growing challenge: balancing flexibility with efficiency. Traditional FPGAs remain essential for rapid prototyping and field reconfigurability, but embedded FPGAs (eFPGAs) are increasingly the smarter choice for new chip developments that need to be future-proof. This article breaks down the key differences between FPGAs and eFPGAs, and how QuickLogic’s open, customizable eFPGA IP delivers ASIC-level performance with FPGA-like adaptability.
Discover how to apply agile methods to hardware development. Boost speed, reduce risk, and build smarter electronics solutions.
Discover how to apply agile methods to hardware development. Boost speed, reduce risk, and build smarter electronics solutions.
Download the white paper to compare eFPGA implementation approaches and identify the right solution for your next SoC design.
Download the white paper to compare eFPGA implementation approaches and identify the right solution for your next SoC design.
Download the white paper to learn how the Nitrogen95 SMARC platform accelerates the development of secure, wireless edge…
Download the white paper to learn how the Nitrogen95 SMARC platform accelerates the development of secure, wireless edge AI systems with integrated AI processing, advanced vision capabilities, and pre-certified connectivity.
Future-Proof Your Test Systems: Discover Driverless Control with VTI’s RESTful Software Traditional driver-based…
Future-Proof Your Test Systems: Discover Driverless Control with VTI’s RESTful Software Traditional driver-based architectures are holding your test systems back—creating costly dependencies and risking obsolescence. Learn how VTI’s RESTful approach delivers platform independence, scalability, and long-term reliability.
Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and…
Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and tools for modern requirements management to help teams reduce errors, improve collaboration, and accelerate delivery.
Discover how to choose the right embedded platform using this white paper from NXP.
Discover how to choose the right embedded platform using this white paper from NXP.
Download the white paper to see how Calibre Vision AI transforms DRC debug with AI-driven insights, faster analysis, and…
Download the white paper to see how Calibre Vision AI transforms DRC debug with AI-driven insights, faster analysis, and smarter error resolution.
Wire bonding is the backbone of high-performance, compact electronics—powering everything from advanced sensors to…
Wire bonding is the backbone of high-performance, compact electronics—powering everything from advanced sensors to high-density semiconductors. Don’t miss our latest white paper to discover how Altium Designer 25’s cutting-edge Wire Bonding feature can transform your PCB designs and keep you ahead of the curve!
Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact,…
Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact, and cost-effective memory solution.
Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along…
Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.
Discover how Synopsys' multi-die solutions tackle the challenges of testing and repairing chiplets, interconnects, and…
Discover how Synopsys' multi-die solutions tackle the challenges of testing and repairing chiplets, interconnects, and multi-die stacks for reliable, high-performance designs.
Optimize your products and accelerate your development with custom Design & Manufacturing Services (DMS).
Optimize your products and accelerate your development with custom Design & Manufacturing Services (DMS).
Find the most suitable system solution for your application.
Find the most suitable system solution for your application.
Learn different isolation technologies and how modern digital isolators overcome the limitations of optocouplers and…
Learn different isolation technologies and how modern digital isolators overcome the limitations of optocouplers and maintain their isolation rating even after a catastrophic EOS event.
EMI filters help ensure an EMI-compliant design.
EMI filters help ensure an EMI-compliant design.
Overcoming Product Lifecycle Challenges: From development to sustainment, the 5 P’s every plan should include.
Overcoming Product Lifecycle Challenges: From development to sustainment, the 5 P’s every plan should include.
Mitigating Cross-Fabric Thermal and Stress Barriers to 3D-ICs
Mitigating Cross-Fabric Thermal and Stress Barriers to 3D-ICs
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