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Overcoming Common Planar Phased Array Circuit Design Challenges

Overcoming Common Planar Phased Array Circuit Design Challenges

Explore practical techniques for improving performance, integration, and scalability in planar phased array circuit architectures.


Powering Tomorrow: The Rising Power Demands of Modern Data Centers

Powering Tomorrow: The Rising Power Demands of Modern Data Centers

As AI data centers race to meet exploding power demands, traditional sensing and power delivery methods are hitting their limits — learn how advanced magnetic current sensors and high-voltage gate drivers are enabling the efficiency, protection, and power density that next-generation architectures require.


Thermal Stress in Data Storage: Effects on Performance, Longevity and Data Integrity

Thermal Stress in Data Storage: Effects on Performance, Longevity and Data Integrity

Download the white paper to learn how thermal stress affects storage performance and reliability.


Powering the Next Generation of High-Efficiency Power Systems with onsemi EliteSiC Technology

Powering the Next Generation of High-Efficiency Power Systems with onsemi EliteSiC Technology

Discover onsemi’s EliteSiC cascode JFET design toolkit — 33 resources to help engineers design higher-efficiency, higher-density power systems.


Industrial Wireless Solutions: The Ultimate Wi-Fi 7 Solutions for Industrial Innovation

Industrial Wireless Solutions: The Ultimate Wi-Fi 7 Solutions for Industrial Innovation

Download the eBook to discover how Advantech’s Wi-Fi 7 solutions are driving industrial connectivity and accelerating AIoT innovation.


Robotic Arms Reach for a New Horizon

Robotic Arms Reach for a New Horizon

Download the white paper to explore how software-driven platforms and AI are reshaping the future of robotic arm design and performance.


Pairing Gate Drive to EliteSic Tutorial

Pairing Gate Drive to EliteSic Tutorial

This tutorial guides engineers on optimizing SiC MOSFET performance in high-power applications like EV chargers, solar inverters, and BLDC motors by minimizing conduction and switching losses while ensuring safety and EMI compliance. It covers gate driver selection, voltage swing requirements, gate charge, and timing strategies to improve efficiency and avoid issues such as runt pulses during high-frequency PWM operation. The tutorial also provides practical guidance on onsemi gate driver products, block diagrams, and application examples.


Top Cool Package for Power Discrete MOSFETs

Top Cool Package for Power Discrete MOSFETs

onsemi’s Top Cool MOSFET package enhances thermal performance by exposing the drain on the top side of the device, allowing direct heatsinking and freeing PCB space for additional components. Testing of the TCPAK57 Top Cool device showed up to 11× lower thermal resistance and greater power-handling capability compared to traditional SO8FL packages. This application note explains how this enables smaller, cooler, and more efficient designs for high-power applications in automotive, industrial, and energy systems.


Power Integration Challenges in Medical Devices

Power Integration Challenges in Medical Devices

Discover how to overcome power integration challenges in medical device design—download our white paper for expert insights and practical solutions.


Next-Level Power Density in Solar and Energy Storage With Silicon Carbide MOSFETs

Next-Level Power Density in Solar and Energy Storage With Silicon Carbide MOSFETs

Download Infineon’s white paper to discover how next-generation silicon carbide MOSFETs unlock higher power density, efficiency, and cost savings in solar and energy storage systems.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


The Advantages of Carbon-Based Thermal Gap Fillers

The Advantages of Carbon-Based Thermal Gap Fillers

Explore the advantages of carbon-based thermal gap fillers.


The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.


System Solution Guide: Heat Pumps

System Solution Guide: Heat Pumps

Learn everything you need to know about heat pumps. This guide looks at single- and three-phase heat pump technology and provides a collection of recommended products that lists the PFCs, inverters, and other components needed for heat pump designs.


From the Lab to The Factory: How the EA Industrial Series Helps with the Development of High-Performance Applications

From the Lab to The Factory: How the EA Industrial Series Helps with the Development of High-Performance Applications

Discover the EA Elektro-Automatik Industrial Series: 21 models of 60 kW devices for high-performance applications, providing flexibility, safety, low energy consumption, and space efficiency.


ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs

ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs

Discover how SMPDs with Silicon Carbide MOSFETs outperform standard discrete packaging, reducing chip temperatures and thermal resistance for increased power output and cost savings.


Design and Manufacturing Services Solution Brief

Design and Manufacturing Services Solution Brief

Optimize your products and accelerate your development with custom Design & Manufacturing Services (DMS).


How Do I Find the Right Form Factor?

How Do I Find the Right Form Factor?

Find the most suitable system solution for your application.


Sustainability, Reliability, Efficiency: A Look Into Today’s Trends and Opportunities in HVAC

Sustainability, Reliability, Efficiency: A Look Into Today’s Trends and Opportunities in HVAC

A look at the global issues and trends driving HVAC systems growth, and the design and technology challenges that must be considered.


Cooling Concept Assessment for High Power Step−Down Conversion

Cooling Concept Assessment for High Power Step−Down Conversion

There are more electronic control units (ECUs) in vehicles than ever before. This white paper from onsemi explains the underlying significance of using a top cool MOSFET to reduce thermal stress on electronic devices.