Many MOSFETs in power applications tend to be surface mount devices. A variety of heat-dissipation concerns arise from this trend, and this application note from onsemi discusses the top cool package developments and other related industry trends.
May 23, 2023 by onsemi
This white paper discusses how SoC verification teams can achieve higher capacity than the desktop prototype and reduce the overall cost of ownership of their hardware verification resources even as it helps to accelerate the verification cycle.
October 29, 2021 by Siemens Digital Industries Software
This white paper describes Siemens' new cloud-based solution and provides use-case examples. Readers will also get a detailed description and testimonial from an early adopter.
August 29, 2021 by Siemens Digital Industries Software
Some engineers believe that the 2D design is no longer sufficient for today’s complicated PCB layouts. Flex and rigid-flex designs, and an increasing need for collaboration with MCAD, require advanced 3D layout design capabilities to address today’s challenges fully.
May 04, 2021 by Siemens Digital Industries Software
A new metric for SerDes channel and package characterization is emerging. Effective Return Loss (ERL) is replacing the traditional frequency-domain Return Loss (RL) metric as a more effective means of characterizing SerDes channels.
May 04, 2021 by Siemens Digital Industries Software
DDRx memory interfaces are key enablers for the technology that shapes modern life. Servers, computers, smartphones, gaming consoles, and GPS systems are just some of the products that demand high-speed, high-bandwidth, double-data-rate memory. Each generation of DDRx DRAM brings new advantages that allow for faster, higher-capacity, and lower-power-consumption products.
May 04, 2021 by Siemens Digital Industries Software
Today, more than ever, as customer demand patterns become more volatile, performance and productivity are under threat. Across the industry, there is rapidly increasing pressure on engineering and materials infrastructures.
February 25, 2021 by Siemens Digital Industries Software
