Latest PCB Layout Industry White Papers

Introduction to 1200 V SiC MOSFET Modules for On-Board Charger Applications

Learn how to take advantage of SiC MOSFETs to enhance your OBC system and get guidance for adopting and transitioning to the SiC technology.

5G SoCs Demand New Verification Approaches

Learn how to create a new verification flow that combines emulation and X STEP, a platform that can generate, capture, and analyze bit-accurate fronthaul traffic.

End-to-End Vehicle Verification

This paper describes how a PreScan, Veloce, and AMEsim tool flow provides the thoroughness of verification to get new cars on the road quickly, efficiently, and safely.

Increase Hardware Emulation Productivity with Virtual Mode Share

Explore the advantages and benefits of Veloce VirtuaLAB emulation, backed up by three test cases.

Veloce Primo Completes a Full SoC Verification Landscape

This white paper discusses how SoC verification teams can achieve higher capacity than the desktop prototype and reduce the overall cost of ownership of their hardware verification resources even as it helps to accelerate the verification cycle.

Automated ESD Protection Verification for 2.5D and 3D ICs

Take a look at verification challenges and walk through a proven automated ESD verification methodology for 2.5D and 3D ICs.

Automated Post-Processing of DRC Errors Improves Debugging Productivity

Learn how to quickly and accurately analyze and fix (or waive) a wide range of complex error conditions with automated post-processing DRC debugging flows.

Online DFM Analysis For Better Products and Faster Cloud-Based Tools For Collaboration Between PCB Designers and Manufacturers

This white paper describes Siemens' new cloud-based solution and provides use-case examples. Readers will also get a detailed description and testimonial from an early adopter.

Leveraging 3D Layout to Optimize PCB System Designs

Some engineers believe that the 2D design is no longer sufficient for today’s complicated PCB layouts. Flex and rigid-flex designs, and an increasing need for collaboration with MCAD, require advanced 3D layout design capabilities to address today’s challenges fully.

Effective Return Loss: A New Metric for SerDes Channel or Package Characterization

A new metric for SerDes channel and package characterization is emerging. Effective Return Loss (ERL) is replacing the traditional frequency-domain Return Loss (RL) metric as a more effective means of characterizing SerDes channels.

The DDRx Memory Interface is the Most Complicated Modern Bus

DDRx memory interfaces are key enablers for the technology that shapes modern life. Servers, computers, smartphones, gaming consoles, and GPS systems are just some of the products that demand high-speed, high-bandwidth, double-data-rate memory. Each generation of DDRx DRAM brings new advantages that allow for faster, higher-capacity, and lower-power-consumption products.

Portability is Key to Competitiveness For PCB Manufacturers

The ability to efficiently move the manufacturing of a product from one physical location to another is critical for any PCB assembly company.

Steps For Ensuring PCB Assembly Success With Valor NPI

Today, more than ever, as customer demand patterns become more volatile, performance and productivity are under threat. Across the industry, there is rapidly increasing pressure on engineering and materials infrastructures.

Smart Manufacturing for Electronics

This white paper describes a transformative approach to electronics manufacturing: a completely digitized strategy that supports both printed circuit board (PCB) and mechanical design/manufacturing, uniting the entire product lifecycle – from idea and production to customers and back.

μModule Data Acquisition Solution Eases Engineering Challenges for a Diverse Set of Precision Applications

The electronic industry’s dynamics are rapidly evolving, and there is less time to build and prototype analog circuits to verify their functionality as the control of research and development (R&D) budgets and time to market (TTM) have become more challenging.

Concepts of Signal Integrity - Crosstalk

Crosstalk is one of the most common signal integrity issues engineers have to deal with. Crosstalk creeps up in electronic designs due to electromagnetic coupling between fringe electric and magnetic fields or transmission lines.

Advanced Electrical Rule Checking in IC Reliability Verification