In any low-power, high-performance design, power integrity analysis is crucial to ensuring that not only can the design deliver the designed performance.
October 19, 2022 by Siemens Digital Industries Software
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.
July 26, 2022 by Siemens Digital Industries Software
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.
July 26, 2022 by Siemens Digital Industries Software
Ensure correct-by-construction filler cell insertion in less time, while using standard industry interfaces that seamlessly integrate with both the P&R and physical verification tools.
July 05, 2022 by Siemens Digital Industries Software
As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design teams to rapidly examine dirty and immature designs to find and fix high-impact circuit errors earlier and faster, leading to an overall reduction in tapeout schedules and time to market.
April 25, 2022 by Siemens Digital Industries Software
Several factors are converging and driving the chiplet design revolution. This paper explores these factors and outlines five key workflows that address and manage the associated, new challenges. The paper recommends workflow adoption focus areas that provide immediate heterogeneous integration capability benefits while establishing a managed methodology adoption and migration process that minimizes disruption, risk, and cost. This will bring heterogeneous integration-based chiplet design within reach of the mainstream instead of being accessible only to the mega iDMs and fabless semiconductor companies.
April 13, 2022 by Siemens Digital Industries Software