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Powering Tomorrow: The Rising Power Demands of Modern Data Centers

Powering Tomorrow: The Rising Power Demands of Modern Data Centers

As AI data centers race to meet exploding power demands, traditional sensing and power delivery methods are hitting their limits — learn how advanced magnetic current sensors and high-voltage gate drivers are enabling the efficiency, protection, and power density that next-generation architectures require.


Thermal Stress in Data Storage: Effects on Performance, Longevity and Data Integrity

Thermal Stress in Data Storage: Effects on Performance, Longevity and Data Integrity

Download the white paper to learn how thermal stress affects storage performance and reliability.


Robotic Arms Reach for a New Horizon

Robotic Arms Reach for a New Horizon

Download the white paper to explore how software-driven platforms and AI are reshaping the future of robotic arm design and performance.


Top Cool Package for Power Discrete MOSFETs

Top Cool Package for Power Discrete MOSFETs

onsemi’s Top Cool MOSFET package enhances thermal performance by exposing the drain on the top side of the device, allowing direct heatsinking and freeing PCB space for additional components. Testing of the TCPAK57 Top Cool device showed up to 11× lower thermal resistance and greater power-handling capability compared to traditional SO8FL packages. This application note explains how this enables smaller, cooler, and more efficient designs for high-power applications in automotive, industrial, and energy systems.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.


System Solution Guide: Heat Pumps

System Solution Guide: Heat Pumps

Learn everything you need to know about heat pumps. This guide looks at single- and three-phase heat pump technology and provides a collection of recommended products that lists the PFCs, inverters, and other components needed for heat pump designs.


Design and Manufacturing Services Solution Brief

Design and Manufacturing Services Solution Brief

Optimize your products and accelerate your development with custom Design & Manufacturing Services (DMS).


How Do I Find the Right Form Factor?

How Do I Find the Right Form Factor?

Find the most suitable system solution for your application.


Sustainability, Reliability, Efficiency: A Look Into Today’s Trends and Opportunities in HVAC

Sustainability, Reliability, Efficiency: A Look Into Today’s Trends and Opportunities in HVAC

A look at the global issues and trends driving HVAC systems growth, and the design and technology challenges that must be considered.


Thermal Management for BEVs with TDK Sensor Solutions Optimized by Computer-Aided Modeling

Thermal Management for BEVs with TDK Sensor Solutions Optimized by Computer-Aided Modeling

The move to e-mobility comes with significant demands. Using electricity exclusively for both motive power and auxiliary features introduces entirely new electromechanical architectures and sub-systems into the automotive domain.


Thermoelectric Cooling for Security Cameras

Thermoelectric Cooling for Security Cameras