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Powering Tomorrow: The Rising Power Demands of Modern Data Centers

Powering Tomorrow: The Rising Power Demands of Modern Data Centers

As AI data centers race to meet exploding power demands, traditional sensing and power delivery methods are hitting their limits — learn how advanced magnetic current sensors and high-voltage gate drivers are enabling the efficiency, protection, and power density that next-generation architectures require.


Improving Server and Industrial Power Supplies with SiC JFETs

Improving Server and Industrial Power Supplies with SiC JFETs

Explore how SiC cascode JFETs boost efficiency, power density, and reliability in AI data center and industrial PSUs with practical design and integration insights.


Building Secure, Wireless Edge AI Systems Faster With the Nitrogen95 SMARC

Building Secure, Wireless Edge AI Systems Faster With the Nitrogen95 SMARC

Download the white paper to learn how the Nitrogen95 SMARC platform accelerates the development of secure, wireless edge AI systems with integrated AI processing, advanced vision capabilities, and pre-certified connectivity.


Altium 365 Security Approach and Practices

Altium 365 Security Approach and Practices

Understand how Altium 365 protects your electronics design data with enterprise‑grade security, compliance, and governance built into every workflow. Download the white paper to see our security approach in detail.


Ensure Long Life Code with VTI’s RESTful Driverless Software

Ensure Long Life Code with VTI’s RESTful Driverless Software

Future-Proof Your Test Systems: Discover Driverless Control with VTI’s RESTful Software Traditional driver-based architectures are holding your test systems back—creating costly dependencies and risking obsolescence. Learn how VTI’s RESTful approach delivers platform independence, scalability, and long-term reliability.


System Solution Guide: AI Data Center

System Solution Guide: AI Data Center

AI data centers require specialized power solutions to support high-performance servers, networking equipment, and storage systems, with rising energy demands driving the adoption of efficient wide bandgap (WBG) materials like SiC and GaN. The guide explores AI data center architecture and power systems, covering components such as racks, PSUs, UPS, BBUs, Solid State Transformers, PDUs, and the shift to high-voltage DC bus bars for improved efficiency and power density. onsemi provides advanced power solutions for AI data centers.


Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Access Panasonic’s whitepaper to optimize your component choices and build a stronger foundation for the future of medtech.


Guide to Requirements Management for Modern Electronics Teams

Guide to Requirements Management for Modern Electronics Teams

Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and tools for modern requirements management to help teams reduce errors, improve collaboration, and accelerate delivery.


From Stationary Arms to Humanoids: The Journey of Mobile Robotics

From Stationary Arms to Humanoids: The Journey of Mobile Robotics

Access this whitepaper to explore key advancements and challenges in robotics, from stationary robotic arms to a new generation of humanoid, agile, and versatile robots.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework for Conformité Européenne (CE) marking. These requirements potentially impact any OEM product, regardless of origin, that is intended to be sold in the EU. Formally known as Regulation (EU) 2024/2847, the CRA applies to any product containing digital elements whose intended purpose or foreseeable use includes a direct or indirect data connection — either logically or physically — to a network or device. This hands-on guide from Digi and NXP provides a walkthrough of the requirements and how to comply. Under this regulation, all products that are capable of connecting to a device or network must meet defined cybersecurity requirements in order to receive CE marking, which is a legal prerequisite for sale within the EU. Products that do not comply cannot be placed on the EU market. At the heart of the CRA is a response to persistent cybersecurity shortcomings. Although many products claim to be secure, there is often no reliable way for consumers or businesses to verify such claims or to ensure ongoing protection. The CRA provides a unified, mandatory framework for cybersecurity compliance that spans the entire product lifecycle.


Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Developing Platform Firmware Resilience with Winbond TrustME® W77Q for Fast Time-to-Market

Winbond's TrustME® W77Q Secure Flash Memory provides an efficient, cost-effective, and easy-to-integrate solution for achieving compliance with NIST 800-193. By leveraging W77Q, system designers can enhance security, reduce development costs, and accelerate time-to-market, ensuring that their products remain resilient against future cyber threats.


From Classical to Quantum-Resistant: The Evolution of Cryptographic Security

From Classical to Quantum-Resistant: The Evolution of Cryptographic Security

Read this white paper to learn how to ensure your cryptographic infrastructure can withstand quantum threats.


A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

Discover how to speed up your design process without sacrificing accuracy using advanced electromagnetic analysis techniques.


ROHM’s RS7xxxxBx Series MOSFETs: Driving Performance & Reliability in Server Power Applications

ROHM’s RS7xxxxBx Series MOSFETs: Driving Performance & Reliability in Server Power Applications

Cloud computing and AI applications have exponentially increased the power needs of data center infrastructure.


Rain AI Tapes-Out Low Power AI Accelerator Chip with Synopsys Cloud and IP in Under a Year

Rain AI Tapes-Out Low Power AI Accelerator Chip with Synopsys Cloud and IP in Under a Year

Read this success story and learn how Rain AI selected Synopsys Cloud SaaS design platform providing end-to-end EDA and IP solutions.


Securing the Cellular IoT Ecosystem: Trends, Regulations and Supply Chain Best Practices

Securing the Cellular IoT Ecosystem: Trends, Regulations and Supply Chain Best Practices

The world is becoming ever more connected, but it must be secured. Read this new report, produced in collaboration with Quectel and IoT Analytics, to learn more about the trends, regulations, and supply chain best practices necessary to securing the cellular IoT ecosystem of today.


Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge servers are essential for fast, reliable data processing across industries, but their performance depends on storage solutions that manage heat and sustain efficiency. Download the white paper now to discover how to optimize your edge infrastructure.


Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.


SRAM PUF - The Secure Silicon Fingerprint

SRAM PUF - The Secure Silicon Fingerprint

Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn about the benefits of this groundbreaking technology, which has already been deployed in hundreds of millions of devices, and how it provides robust, flexible, and cost-effective solutions for protecting our connected world.