Using this comprehensive guide, engineers will feel confident to switch to Silicon Carbide (SiC). They can leverage SiC's low switching losses, improved system efficiency, high power density in a smaller footprint, 3x superiority to silicon in thermal conduction, and many other benefits. Download your copy here!
August 18, 2022 by Future Electronics
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.
July 26, 2022 by Siemens Digital Industries Software
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.
July 26, 2022 by Siemens Digital Industries Software
This educational note provides performance parameters to consider when evaluating signal generators for your receiver testing. This will ensure that the signal generator provides a level of performance that has minimal effect on your receiver measurements.
July 20, 2022 by Rohde & Schwarz
Unveil the challenges that mode-agile radar and EW threat emitters pose to traditional static threat library implementations in radar and EW systems, and consider the architecture of cognitive artificial intelligence (AI) and machine learning (ML) systems that can be used to deliver effective RF countermeasures. This whitepaper also explains how a wideband RF record, simulation and playback system can be used to train the AI/ML engines, and evaluates the responses and effectiveness of those countermeasures on real hardware.
June 30, 2022 by Rohde & Schwarz
To achieve a reliable and efficient system verification and debug of DDR3/DDR4 memory designs, comprehensive compliance test and analysis tools are required. While measurement capability and usability are critical to speed up the verification and debug process, it is equally important to choose the right probing solution and use advanced techniques to improve overall measurement accuracy. Selecting the right probe, probing at the right place, modifying probe tip impedance to compensate interposer resistors and improving the measurement accuracy through deembedding are important to attain repeatable and accurate test results. This step-by-step guide can help you.
April 01, 2022 by Rohde & Schwarz
MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper explores how electronics and sensors are powering today's connected vehicles.
March 08, 2022 by Murata
This application brochure provides a detailed look at the design challenges that accompany smartwatches, sports watches, wristbands, and medical wrist-worn devices. This resource also discusses how to address and solve issues like data security, sensor accuracy, connectivity, and device protection.
August 27, 2021 by Infineon Technologies
This use case from TAIYO YUDEN takes a closer look at how small cell base stations aid faster 5G adoption, the role of RF filtering in 5G wireless connectivity, and how TAIYO YUDEN solutions help provide seamless connectivity in 5G applications.
June 18, 2021 by TAIYO YUDEN
