This application note describes the structure and design philosophy of onsemi High-Side SmartFETs, and provides specific examples and numerical calculations of how to apply SmartFETs with analog current sense into your system to achieve the optimal switching performance.
November 09, 2022 by onsemi
Using this comprehensive guide, engineers will feel confident to switch to Silicon Carbide (SiC). They can leverage SiC's low switching losses, improved system efficiency, high power density in a smaller footprint, 3x superiority to silicon in thermal conduction, and many other benefits. Download your copy here!
August 18, 2022 by Future Electronics
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.
July 26, 2022 by Siemens Digital Industries Software
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.
July 26, 2022 by Siemens Digital Industries Software
