Many MOSFETs in power applications tend to be surface mount devices. A variety of heat-dissipation concerns arise from this trend, and this application note from onsemi discusses the top cool package developments and other related industry trends.
May 23, 2023 by onsemi
The move to e-mobility comes with significant demands. Using electricity exclusively for both motive power and auxiliary features introduces entirely new electromechanical architectures and sub-systems into the automotive domain.
March 03, 2022 by TDK Electronics
November 11, 2020 by Laird
