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Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


SGeT SMARC Design Guide Version 2.2

SGeT SMARC Design Guide Version 2.2

Download ADLINK’s SMARC Design Guide V2.2 for expert insights on scalable, low-power embedded designs for IoT, automation, and edge computing.


Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework for Conformité Européenne (CE) marking. These requirements potentially impact any OEM product, regardless of origin, that is intended to be sold in the EU. Formally known as Regulation (EU) 2024/2847, the CRA applies to any product containing digital elements whose intended purpose or foreseeable use includes a direct or indirect data connection — either logically or physically — to a network or device. This hands-on guide from Digi and NXP provides a walkthrough of the requirements and how to comply. Under this regulation, all products that are capable of connecting to a device or network must meet defined cybersecurity requirements in order to receive CE marking, which is a legal prerequisite for sale within the EU. Products that do not comply cannot be placed on the EU market. At the heart of the CRA is a response to persistent cybersecurity shortcomings. Although many products claim to be secure, there is often no reliable way for consumers or businesses to verify such claims or to ensure ongoing protection. The CRA provides a unified, mandatory framework for cybersecurity compliance that spans the entire product lifecycle.


PCB Assembly Tips Every Engineer Should Know

PCB Assembly Tips Every Engineer Should Know

Summit Interconnect’s free 9-page PCB Assembly Guide puts essential assembly tips and answers right at your fingertips. Download, print, and keep it on your desk for quick reference.


RRAM — Transforming Memory Solutions for AI-Driven IoT Devices and Embedded Systems

RRAM — Transforming Memory Solutions for AI-Driven IoT Devices and Embedded Systems

Unlock the Power of High-Performance Memory Solutions


Using Mixed Signal Oscilloscopes to Find and Diagnose Jitter Caused by Power Integrity Problems

Using Mixed Signal Oscilloscopes to Find and Diagnose Jitter Caused by Power Integrity Problems

This guide explores how power integrity issues affect signal jitter and shows how mixed signal oscilloscopes can pinpoint and resolve root causes.


Meeting the European Union’s Radio Equipment Directive (RED) Cybersecurity Standards

Meeting the European Union’s Radio Equipment Directive (RED) Cybersecurity Standards

Winbond’s W77Q and W77T secure flash devices offer manufacturers a simple, effective path to compliance with the latest cybersecurity standards under the Radio Equipment Directive.


Transforming Machine Learning with Alif MCUs

Transforming Machine Learning with Alif MCUs

Download Alif Semiconductor's free white paper today and discover how Alif MCUs are transforming machine learning at the edge!


A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

Discover how to speed up your design process without sacrificing accuracy using advanced electromagnetic analysis techniques.


Accurate Test Fixture Characterization and De-embedding

Accurate Test Fixture Characterization and De-embedding

This application note offers practical guidance on characterizing and de-embedding lead-in and lead-out structures for accurate measurements of non-connectorized devices using vector network analyzers. It also explains how to export S-Parameter files for use with other test equipment, ensuring precise results across various instruments.


Simplify Smart Factory Transformation with AI Vision for Enhanced Yield and Predictive Maintenance

Simplify Smart Factory Transformation with AI Vision for Enhanced Yield and Predictive Maintenance

Discover how NXP Semiconductors is revolutionizing manufacturing with AI-driven predictive maintenance and automated systems by reading our full case study.


Bring Your Wearables to the Next Level with Infineon’s Sensing, RF, Power, Connectivity and Security Solutions

Bring Your Wearables to the Next Level with Infineon’s Sensing, RF, Power, Connectivity and Security Solutions

Download Free Infineon Application Brochure on Medical Writ-worn Devices!


Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

Advanced Embedded Systems Debug with Jitter and Real-Time Eye Analysis

RIGOL App Note shows how to use oscilloscopes to test long term signal quality characteristics including jitter and eye patterns without investing in high performance, high cost solutions. Download to learn more about Advanced Embedded Systems Debug.


ISO 13485: Excellence Beyond Medical Devices

ISO 13485: Excellence Beyond Medical Devices

Variscite, a leading provider of Systems on Module (SoMs), has been a key player in embedded solutions for nearly two decades. As an NXP Platinum Partner, the company utilizes NXP’s i.MX 6, 7, 8, and 9 series processors to develop high-performance SoMs for various industries.


Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and vehicle status by projecting information directly onto the windshield.


From Analog to AI: The Sensor Continuum

From Analog to AI: The Sensor Continuum

Sensors are a machine’s interface into our world. Download this white paper to learn how advancements are enabling new applications, increasing automation and productivity.


Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.


SRAM PUF - The Secure Silicon Fingerprint

SRAM PUF - The Secure Silicon Fingerprint

Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn about the benefits of this groundbreaking technology, which has already been deployed in hundreds of millions of devices, and how it provides robust, flexible, and cost-effective solutions for protecting our connected world.


Unlocking Innovation with Cost- Optimized FPGAs and Adaptive SOCS

Unlocking Innovation with Cost- Optimized FPGAs and Adaptive SOCS

The ebook will introduce the future of AMD costoptimized devices and explore how the company’s long-term commitment to a cost-optimized portfolio (COP) of low-density and mid-range FPGAs helps deliver the advantages of programmable logic to nearly every application.