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Beyond Batteries: Paving the Way for the Future

Beyond Batteries: Paving the Way for the Future

Download this white paper for a deeper look into power consumption and power management for IoT.


Hints for IEEE 802.11BE EVM Measurements

Hints for IEEE 802.11BE EVM Measurements

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters, specifically focusing on the IEEE 802.11be standard (Wi-Fi 7). It outlines key features such as increased channel bandwidth, advanced modulation schemes, and multi-link operation, which aim to enhance throughput and reduce latency in wireless communication systems.


Over the Horizon — Principles and Challenges of Operating in The HF Band

Over the Horizon — Principles and Challenges of Operating in The HF Band

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation, interference sources, and systems like US ROTHR and Australia's JORN.


Poster: 5G Evolving Infrastructure

Poster: 5G Evolving Infrastructure

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies shaping 5G — perfect for your lab or personal workspace!


Comparing Parameters of Shunt-based and Hall-based Current Sensors

Comparing Parameters of Shunt-based and Hall-based Current Sensors

Optimize your electrical systems with Allegro's current sensors, offering superior accuracy, reliability, and integration for enhanced performance and simplified design. Explore our advanced Hall-effect sensor solutions today!


From Analog to AI: The Sensor Continuum

From Analog to AI: The Sensor Continuum

Sensors are a machine’s interface into our world. Download this white paper to learn how advancements are enabling new applications, increasing automation and productivity.


Analog Computing for Artificial Intelligence: How to Perform MAC Operations Using Ohm’s Law

Analog Computing for Artificial Intelligence: How to Perform MAC Operations Using Ohm’s Law

Explore the potential for analog computing to revolutionize the energy landscape for AI systems and present technical considerations for implementing analog MAC operations using a novel Neuromorphic Analog Signal Processing (NASP) technology.


Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.


Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Learn how image sensors using pixel overflow technology provided increased dynamic range and LED flicker mitigation when compared to competing multiple exposure and split-diode exposure technologies. Super-exposure pixels are ideal for demanding automotive applications.


SRAM PUF - The Secure Silicon Fingerprint

SRAM PUF - The Secure Silicon Fingerprint

Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn about the benefits of this groundbreaking technology, which has already been deployed in hundreds of millions of devices, and how it provides robust, flexible, and cost-effective solutions for protecting our connected world.


The Metaverse and Extended Reality

The Metaverse and Extended Reality

Discover the metaverse, a cutting-edge realm where the physical and digital worlds converge. Our white paper offers a comprehensive foundation for understanding the transformative potential of the metaverse and extended reality (XR), as well as their impact on our daily lives.


Why LTE Cat 1 and Cat 1 bis Continue to Drive Cellular IoT Connection Growth

Why LTE Cat 1 and Cat 1 bis Continue to Drive Cellular IoT Connection Growth

Read this white paper to better understand the advantages of Cat 1 bis, market forecasts for this, adjacent IoT technologies, and how Quectel can help you make the most of the opportunities at hand.


An Introduction to Passive Radar Systems: A Test and Measurement Perspective

An Introduction to Passive Radar Systems: A Test and Measurement Perspective

Explore the fundamentals of passive radar, emitters of opportunity, and satellite applications in stealth technology. Download this white paper to deepen your understanding of the latest innovations in RDT&E for passive radar systems.


How Automotive Manufacturers Are Managing Risk With Their Image Sensor Suppliers

How Automotive Manufacturers Are Managing Risk With Their Image Sensor Suppliers

Sensors are vital components in today’s modern vehicles, which is why ensuring a well-maintained global supply chain is so important with these devices. This white paper explores the challenges of sensor supply chain management and how an effective manufacturing strategy plays an essential role, making use of a hybrid internal/external manufacturing approach.


Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Sign up and access onsemi’s guide to do more with Silicon Carbide solutions.


Unlocking Innovation with Cost- Optimized FPGAs and Adaptive SOCS

Unlocking Innovation with Cost- Optimized FPGAs and Adaptive SOCS

The ebook will introduce the future of AMD costoptimized devices and explore how the company’s long-term commitment to a cost-optimized portfolio (COP) of low-density and mid-range FPGAs helps deliver the advantages of programmable logic to nearly every application.


MCX A Series: The All-Purpose MCU for Embedded Innovation

MCX A Series: The All-Purpose MCU for Embedded Innovation

Find out how this all-purpose MCU plays a significant role in the overall MCX portfolio by NXP. Sign up to access the MCX A Series White Paper.


Enabling Efficient Multi-Die Design Implementation and IP Integration

Enabling Efficient Multi-Die Design Implementation and IP Integration

Discover how Synopsys integrates UCIe IP and 3DIC Compiler to enable efficient multi-die design implementation and IP integration, addressing the challenges of advanced 2.5D and 3D technologies for high-performance applications like AI, automotive, and mobile.


5G NTN Takes Flight

5G NTN Takes Flight

To learn more about the evolving landscape of 5G-NTN and its potential to revolutionize global connectivity, download our white paper now.


The Software-Defined Manufacturing Revolution

The Software-Defined Manufacturing Revolution

Download this eBook to learn about two key technologies driving the future of industrial automation: workload consolidation and time-sensitive networks.