Latest Industry White Papers

Download the white paper to learn how Synopsys USB IP leverages advanced low-power states to maximize efficiency while…

Download the white paper to learn how Synopsys USB IP leverages advanced low-power states to maximize efficiency while maintaining seamless performance across USB generations.

Explore the fundamentals, challenges, and potential use cases of THz communications with this informative poster by Rohde…

Explore the fundamentals, challenges, and potential use cases of THz communications with this informative poster by Rohde & Schwarz.

Learn how ADLINK’s SMARC LEC-IMX95 transforms edge design with compact power and flexibility. Access the full story now.

Learn how ADLINK’s SMARC LEC-IMX95 transforms edge design with compact power and flexibility. Access the full story now.

Download ADLINK’s SMARC Design Guide V2.2 for expert insights on scalable, low-power embedded designs for IoT,…

Download ADLINK’s SMARC Design Guide V2.2 for expert insights on scalable, low-power embedded designs for IoT, automation, and edge computing.

This comprehensive guide examines both SiC and IGBT technologies for traction inverter applications and will help you…

This comprehensive guide examines both SiC and IGBT technologies for traction inverter applications and will help you develop optimized solutions.

This white paper addresses the design challenges of industrial lithium battery chargers and reviews power topologies like…

This white paper addresses the design challenges of industrial lithium battery chargers and reviews power topologies like boost PFC, totem pole PFC, and LLC resonant converters optimized with onsemi’s 650 V M3S EliteSiC MOSFETs. These advanced SiC devices enable high-efficiency, high-frequency operation across power levels from 600 W to 12 kW, supporting compact, passively cooled charger designs. The paper also highlights onsemi’s simulation tools, which help engineers accelerate development by modeling real-world conditions and optimizing system performance.

VDI (Vital Data Intelligence) Compliance Insights couples Accuris’ data on over 1.2 billion electronic parts with…

VDI (Vital Data Intelligence) Compliance Insights couples Accuris’ data on over 1.2 billion electronic parts with EETech’s VDI Platform.

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict…

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework for Conformité Européenne (CE) marking. These requirements potentially impact any OEM product, regardless of origin, that is intended to be sold in the EU. Formally known as Regulation (EU) 2024/2847, the CRA applies to any product containing digital elements whose intended purpose or foreseeable use includes a direct or indirect data connection — either logically or physically — to a network or device. This hands-on guide from Digi and NXP provides a walkthrough of the requirements and how to comply. Under this regulation, all products that are capable of connecting to a device or network must meet defined cybersecurity requirements in order to receive CE marking, which is a legal prerequisite for sale within the EU. Products that do not comply cannot be placed on the EU market. At the heart of the CRA is a response to persistent cybersecurity shortcomings. Although many products claim to be secure, there is often no reliable way for consumers or businesses to verify such claims or to ensure ongoing protection. The CRA provides a unified, mandatory framework for cybersecurity compliance that spans the entire product lifecycle.

Learn more about power electronics characterization and the power test equipment solutions from SIGLENT including power…

Learn more about power electronics characterization and the power test equipment solutions from SIGLENT including power supplies, loads, oscilloscopes, probing, generators, and more.

Learn more about creating and using complex RF signals for emulation, interference, and characterization in RF analog…

Learn more about creating and using complex RF signals for emulation, interference, and characterization in RF analog signal generators and vector signal generators.

Summit Interconnect’s free 9-page PCB Assembly Guide puts essential assembly tips and answers right at your fingertips.…

Summit Interconnect’s free 9-page PCB Assembly Guide puts essential assembly tips and answers right at your fingertips. Download, print, and keep it on your desk for quick reference.

Download this Case Study to explore how NXP and Ezurio are enabling the next generation of intelligent building infrastructure.

Download this Case Study to explore how NXP and Ezurio are enabling the next generation of intelligent building infrastructure.

Winbond's TrustME® W77Q Secure Flash Memory provides an efficient, cost-effective, and easy-to-integrate solution for…

Winbond's TrustME® W77Q Secure Flash Memory provides an efficient, cost-effective, and easy-to-integrate solution for achieving compliance with NIST 800-193. By leveraging W77Q, system designers can enhance security, reduce development costs, and accelerate time-to-market, ensuring that their products remain resilient against future cyber threats.

With arbitrary waveform generation and synchronized outputs, intelligent power supplies simplify signal source…

With arbitrary waveform generation and synchronized outputs, intelligent power supplies simplify signal source development when testing complex electrical devices.

Ultra-fast EV charging enables high-power DC charging—up to 1 MW—directly to EV batteries, drastically reducing…

Ultra-fast EV charging enables high-power DC charging—up to 1 MW—directly to EV batteries, drastically reducing charging time and supporting next-gen 800V+ vehicle architectures. This guide outlines key design considerations, from charging topologies like Vienna Rectifier and Dual Active Bridge to system features like bi-directional power flow and PV-storage integration. onsemi offers a complete portfolio of SiC MOSFETs, IGBTs, gate drivers, and evaluation kits to help engineers build efficient, scalable, and safe fast-charging solutions.

Download Infineon’s white paper, “Designing Smarter, More Efficient HVAC Systems with PSOC™ Control C3,” and…

Download Infineon’s white paper, “Designing Smarter, More Efficient HVAC Systems with PSOC™ Control C3,” and learn how to accelerate innovation in your next smart building project.

Solid-State Circuit Breakers (SSCB) use advanced SiC-based semiconductor technology to provide faster, more reliable, and…

Solid-State Circuit Breakers (SSCB) use advanced SiC-based semiconductor technology to provide faster, more reliable, and arc-free circuit protection compared to traditional mechanical breakers. This guide outlines the key components and design considerations for building SSCB systems, including switch types, sensing methods, and integration with wireless communication and ground fault protection. It also features system diagrams, recommended onsemi devices, and simulation tools to support efficient and high-performance SSCB design.

Zonal Architecture is transforming vehicle electronics by decentralizing power and data management through Zonal Control…

Zonal Architecture is transforming vehicle electronics by decentralizing power and data management through Zonal Control Units (ZCUs), reducing wiring complexity and enabling Software Defined Vehicles (SDVs). This guide explores the shift from legacy to zonal systems, highlights technologies like SmartFETs, eFuses, and 10BASE-T1S Ethernet, and explains how centralized computing supports features like over-the-air updates and ADAS.

Download the white paper to explore how multi-die designs are powering the next generation of HPC chips.

Download the white paper to explore how multi-die designs are powering the next generation of HPC chips.