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AIoT: Connecting AI to the Real World

AIoT: Connecting AI to the Real World

This paper discusses how connectivity enables the AIoT, and gives a detailed review of the considerations for AIoT deployment. It explains where Matter fits today and how the Matter approach, which relies on an application layer of standardized protocols, security and semantics, can still benefit verticals that are, as of now, beyond the scope of Matter.


How Google and Intel use Calibre DesignEnhancer to Reduce IR drop and Improve Reliability

How Google and Intel use Calibre DesignEnhancer to Reduce IR drop and Improve Reliability

Explore how the Calibre DesignEnhancer (DE) analysis-based, signoff-quality EMIR solution helps design teams achieving both Design Rule Check (DRC) clean layouts and optimal electrical performance.


Enabling Power Supplies for Automotive Camera Modules

Enabling Power Supplies for Automotive Camera Modules

Access this whitepaper to get in-depth insights and solutions. Get a head start on the future of automotive applications with Taiyo Yuden.


Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge servers are essential for fast, reliable data processing across industries, but their performance depends on storage solutions that manage heat and sustain efficiency. Download the white paper now to discover how to optimize your edge infrastructure.


Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Learn how Broadcom´s miniature series of reflective encoders can provide accurate positioning feedback to linear actuator systems that are integrated in robotic hand applications.


Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and vehicle status by projecting information directly onto the windshield.


Understanding Power, Performance, and Area Tradeoffs for Analog IC Designs

Understanding Power, Performance, and Area Tradeoffs for Analog IC Designs

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss the trade-offs between these indicators and how the PPA metric supports the comparison of analog capabilities across different processes. Finally, using the PPA figure of merit, it is shown that the onsemi 65 nm BCD Treo platform provides at least a 5x integral improvement on average over older 180 nm technologies.


Beyond Batteries: Paving the Way for the Future

Beyond Batteries: Paving the Way for the Future

Download this white paper for a deeper look into power consumption and power management for IoT.


Revolutionizing Edge AI Computing with CUBE

Revolutionizing Edge AI Computing with CUBE

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact, and cost-effective memory solution.


Hints for IEEE 802.11BE EVM Measurements

Hints for IEEE 802.11BE EVM Measurements

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters, specifically focusing on the IEEE 802.11be standard (Wi-Fi 7). It outlines key features such as increased channel bandwidth, advanced modulation schemes, and multi-link operation, which aim to enhance throughput and reduce latency in wireless communication systems.


Over the Horizon — Principles and Challenges of Operating in The HF Band

Over the Horizon — Principles and Challenges of Operating in The HF Band

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation, interference sources, and systems like US ROTHR and Australia's JORN.


Signal Integrity Analysis for High Speed Datacom Interfaces

Signal Integrity Analysis for High Speed Datacom Interfaces

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity, addressing the challenges posed by connecting these interfaces to oscilloscopes. It showcases how oscilloscopes with advanced jitter options can effectively analyze jitter contributions and assess the impact of test fixtures and traces on measurement accuracy.


Next-Gen 650 V SiC MOSFETs Improve Performance for EV Applications

Next-Gen 650 V SiC MOSFETs Improve Performance for EV Applications

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications. This white paper investigates onsemi’s M3S 650V SiC MOSFET technology for high-speed switching power applications in electric vehicles and other energy-efficient systems.


Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This shift-left approach enhances productivity, simplifies debugging and cuts time-to-market.


Thermal and Electrical Modeling and Optimization of SiC Power Modules for Traction Inverters

Thermal and Electrical Modeling and Optimization of SiC Power Modules for Traction Inverters

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule heating. This paper investigates these key characteristics, demonstrates the effectiveness of simulation tools in modeling SiC power module performance, and proposes mitigation measures to further improve reliability.


Poster: 5G Evolving Infrastructure

Poster: 5G Evolving Infrastructure

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies shaping 5G — perfect for your lab or personal workspace!


Poster: Open RAN Network Topology

Poster: Open RAN Network Topology

Get deep insights into the topology of O-RAN with this informative, attractive poster — great for the lab or your personal workspace.


The Advantages of Carbon-Based Thermal Gap Fillers

The Advantages of Carbon-Based Thermal Gap Fillers

Explore the advantages of carbon-based thermal gap fillers.


Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Micro-electro-mechanical systems (MEMS) technology has provided the foundation for transformational change in the electronics industry. In timing components, MEMS technology enables superior performance compared to traditional quartz oscillators in key areas such as greater stability, far higher shock and vibration resistance, higher reliability, and smaller size.


Bidirectional Programmable DC Power Supplies Augment Simulation and Test

Bidirectional Programmable DC Power Supplies Augment Simulation and Test

In this white paper, you will dive deep into how bidirectional and regenerative technology empowers you to achieve unparalleled control and efficiency.