Latest Industry White Papers

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as…

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and vehicle status by projecting information directly onto the windshield.

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss…

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss the trade-offs between these indicators and how the PPA metric supports the comparison of analog capabilities across different processes. Finally, using the PPA figure of merit, it is shown that the onsemi 65 nm BCD Treo platform provides at least a 5x integral improvement on average over older 180 nm technologies.

Download this white paper for a deeper look into power consumption and power management for IoT.

Download this white paper for a deeper look into power consumption and power management for IoT.

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact,…

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact, and cost-effective memory solution.

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters,…

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters, specifically focusing on the IEEE 802.11be standard (Wi-Fi 7). It outlines key features such as increased channel bandwidth, advanced modulation schemes, and multi-link operation, which aim to enhance throughput and reduce latency in wireless communication systems.

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation,…

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation, interference sources, and systems like US ROTHR and Australia's JORN.

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity,…

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity, addressing the challenges posed by connecting these interfaces to oscilloscopes. It showcases how oscilloscopes with advanced jitter options can effectively analyze jitter contributions and assess the impact of test fixtures and traces on measurement accuracy.

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications.…

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications. This white paper investigates onsemi’s M3S 650V SiC MOSFET technology for high-speed switching power applications in electric vehicles and other energy-efficient systems.

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local…

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This shift-left approach enhances productivity, simplifies debugging and cuts time-to-market.

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule…

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule heating. This paper investigates these key characteristics, demonstrates the effectiveness of simulation tools in modeling SiC power module performance, and proposes mitigation measures to further improve reliability.

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies…

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies shaping 5G — perfect for your lab or personal workspace!

Get deep insights into the topology of O-RAN with this informative, attractive poster — great for the lab or your…

Get deep insights into the topology of O-RAN with this informative, attractive poster — great for the lab or your personal workspace.

Explore the advantages of carbon-based thermal gap fillers.

Explore the advantages of carbon-based thermal gap fillers.

Micro-electro-mechanical systems (MEMS) technology has provided the foundation for transformational change in the…

Micro-electro-mechanical systems (MEMS) technology has provided the foundation for transformational change in the electronics industry. In timing components, MEMS technology enables superior performance compared to traditional quartz oscillators in key areas such as greater stability, far higher shock and vibration resistance, higher reliability, and smaller size.

In this white paper, you will dive deep into how bidirectional and regenerative technology empowers you to achieve…

In this white paper, you will dive deep into how bidirectional and regenerative technology empowers you to achieve unparalleled control and efficiency.

ICs that can operate in high-temperatures play a critical role in applications such as industrial, military, and…

ICs that can operate in high-temperatures play a critical role in applications such as industrial, military, and automotive. This white paper explains how onsemi’s Treo Platform provides a comprehensive product development ecosystem designed for high-temperature use operation. Understand high junction temperature challenges, high temperature device models, how to deal with leakage issues, digital offset compensation techniques, and more.

Read this white paper to enhance your security to protect sensitive design data while ensuring compliance with government…

Read this white paper to enhance your security to protect sensitive design data while ensuring compliance with government regulations.

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and…

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.

Download this white paper to learn how to create better products by streamlining collaboration between PCB and mechanical…

Download this white paper to learn how to create better products by streamlining collaboration between PCB and mechanical designers.