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Securing the Cellular IoT Ecosystem: Trends, Regulations and Supply Chain Best Practices

Securing the Cellular IoT Ecosystem: Trends, Regulations and Supply Chain Best Practices

The world is becoming ever more connected, but it must be secured. Read this new report, produced in collaboration with Quectel and IoT Analytics, to learn more about the trends, regulations, and supply chain best practices necessary to securing the cellular IoT ecosystem of today.


Maximize Efficiency with a Cost-Effective Silicon-Based Vienna Rectifier Solution

Maximize Efficiency with a Cost-Effective Silicon-Based Vienna Rectifier Solution

Optimize your Vienna rectifier design with a cost-effective silicon-based solution. Download this white paper to explore performance insights and design strategies.


The Future of Standardized Defense Platforms Using MOSA, SOSA, and VPX Open Architectures

The Future of Standardized Defense Platforms Using MOSA, SOSA, and VPX Open Architectures

This technical paper provides a better understanding of the benefits and advantages of moving to an open architecture modular power supply system approach and how this modular design supports greater flexibility, scalability, reliability and faster time to market as compared to non-standardized power design options.


Wi-Fi 7 Technology Introduction

Wi-Fi 7 Technology Introduction

IEEE 802.11be (Wi-Fi 7) offers extremely high throughput, lower latency, and higher reliability, with advancements like wider bandwidths and multi-link operation. Explore the key technologies and testing challenges in this comprehensive white paper.


Fuji HPnC: High-Power IGBT Modules for Industrial-scale Applications

Fuji HPnC: High-Power IGBT Modules for Industrial-scale Applications

Explore the key features and benefits of Fuji Electric's HPnC 7th generation IGBT modules in this white paper from Fuji Electric


DIN Rail Smart Protection: RACPRO1 E-Fuse Modules

DIN Rail Smart Protection: RACPRO1 E-Fuse Modules

Explore the RACPRO1 e-Fuse series, which offers advanced DC protection with intelligent load current limiting, overload and fault detection, and simplified installation.


Making User-Friendly Products: Overcoming Challenges in the Practical Application of GaN, a Promising Next-Generation Power Semiconductor

Making User-Friendly Products: Overcoming Challenges in the Practical Application of GaN, a Promising Next-Generation Power Semiconductor

In this article, ROHM will discuss the challenges of commercializing GaN power devices, a next-generation power semiconductor expected to improve energy savings and miniaturization in a variety of applications.


Striving for Zero Malfunctions: Behind the Scenes of ROHM’s Ongoing EMC Measures

Striving for Zero Malfunctions: Behind the Scenes of ROHM’s Ongoing EMC Measures

This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.


AIoT: Connecting AI to the Real World

AIoT: Connecting AI to the Real World

This paper discusses how connectivity enables the AIoT, and gives a detailed review of the considerations for AIoT deployment. It explains where Matter fits today and how the Matter approach, which relies on an application layer of standardized protocols, security and semantics, can still benefit verticals that are, as of now, beyond the scope of Matter.


How Google and Intel use Calibre DesignEnhancer to Reduce IR drop and Improve Reliability

How Google and Intel use Calibre DesignEnhancer to Reduce IR drop and Improve Reliability

Explore how the Calibre DesignEnhancer (DE) analysis-based, signoff-quality EMIR solution helps design teams achieving both Design Rule Check (DRC) clean layouts and optimal electrical performance.


Enabling Power Supplies for Automotive Camera Modules

Enabling Power Supplies for Automotive Camera Modules

Access this whitepaper to get in-depth insights and solutions. Get a head start on the future of automotive applications with Taiyo Yuden.


Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge Server Storage: Meeting the Demands of High Performance and Heat Control

Edge servers are essential for fast, reliable data processing across industries, but their performance depends on storage solutions that manage heat and sustain efficiency. Download the white paper now to discover how to optimize your edge infrastructure.


Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Learn how Broadcom´s miniature series of reflective encoders can provide accurate positioning feedback to linear actuator systems that are integrated in robotic hand applications.


Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Enhancing Automotive Head-Up Display Systems with ROHM’s ML86178 Controller IC

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and vehicle status by projecting information directly onto the windshield.


Understanding Power, Performance, and Area Tradeoffs for Analog IC Designs

Understanding Power, Performance, and Area Tradeoffs for Analog IC Designs

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss the trade-offs between these indicators and how the PPA metric supports the comparison of analog capabilities across different processes. Finally, using the PPA figure of merit, it is shown that the onsemi 65 nm BCD Treo platform provides at least a 5x integral improvement on average over older 180 nm technologies.


Beyond Batteries: Paving the Way for the Future

Beyond Batteries: Paving the Way for the Future

Download this white paper for a deeper look into power consumption and power management for IoT.


Revolutionizing Edge AI Computing with CUBE

Revolutionizing Edge AI Computing with CUBE

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact, and cost-effective memory solution.


Hints for IEEE 802.11BE EVM Measurements

Hints for IEEE 802.11BE EVM Measurements

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters, specifically focusing on the IEEE 802.11be standard (Wi-Fi 7). It outlines key features such as increased channel bandwidth, advanced modulation schemes, and multi-link operation, which aim to enhance throughput and reduce latency in wireless communication systems.


Over the Horizon — Principles and Challenges of Operating in The HF Band

Over the Horizon — Principles and Challenges of Operating in The HF Band

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation, interference sources, and systems like US ROTHR and Australia's JORN.


Signal Integrity Analysis for High Speed Datacom Interfaces

Signal Integrity Analysis for High Speed Datacom Interfaces

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity, addressing the challenges posed by connecting these interfaces to oscilloscopes. It showcases how oscilloscopes with advanced jitter options can effectively analyze jitter contributions and assess the impact of test fixtures and traces on measurement accuracy.