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Next-Gen 650 V SiC MOSFETs Improve Performance for EV Applications

Next-Gen 650 V SiC MOSFETs Improve Performance for EV Applications

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications. This white paper investigates onsemi’s M3S 650V SiC MOSFET technology for high-speed switching power applications in electric vehicles and other energy-efficient systems.


Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This shift-left approach enhances productivity, simplifies debugging and cuts time-to-market.


Thermal and Electrical Modeling and Optimization of SiC Power Modules for Traction Inverters

Thermal and Electrical Modeling and Optimization of SiC Power Modules for Traction Inverters

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule heating. This paper investigates these key characteristics, demonstrates the effectiveness of simulation tools in modeling SiC power module performance, and proposes mitigation measures to further improve reliability.


Poster: 5G Evolving Infrastructure

Poster: 5G Evolving Infrastructure

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies shaping 5G — perfect for your lab or personal workspace!


Poster: Open RAN Network Topology

Poster: Open RAN Network Topology

Get deep insights into the topology of O-RAN with this informative, attractive poster — great for the lab or your personal workspace.


The Advantages of Carbon-Based Thermal Gap Fillers

The Advantages of Carbon-Based Thermal Gap Fillers

Explore the advantages of carbon-based thermal gap fillers.


Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Micro-electro-mechanical systems (MEMS) technology has provided the foundation for transformational change in the electronics industry. In timing components, MEMS technology enables superior performance compared to traditional quartz oscillators in key areas such as greater stability, far higher shock and vibration resistance, higher reliability, and smaller size.


Bidirectional Programmable DC Power Supplies Augment Simulation and Test

Bidirectional Programmable DC Power Supplies Augment Simulation and Test

In this white paper, you will dive deep into how bidirectional and regenerative technology empowers you to achieve unparalleled control and efficiency.


High Temperature Analog and Mixed-Signal Solutions Enabled by the Treo Platform

High Temperature Analog and Mixed-Signal Solutions Enabled by the Treo Platform

ICs that can operate in high-temperatures play a critical role in applications such as industrial, military, and automotive. This white paper explains how onsemi’s Treo Platform provides a comprehensive product development ecosystem designed for high-temperature use operation. Understand high junction temperature challenges, high temperature device models, how to deal with leakage issues, digital offset compensation techniques, and more.


Altium 365 Security Approach & Practices

Altium 365 Security Approach & Practices

Read this white paper to enhance your security to protect sensitive design data while ensuring compliance with government regulations.


The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.


Collaborative Design for MCAD and PCB Designers

Collaborative Design for MCAD and PCB Designers

Download this white paper to learn how to create better products by streamlining collaboration between PCB and mechanical designers.


Comparing Parameters of Shunt-based and Hall-based Current Sensors

Comparing Parameters of Shunt-based and Hall-based Current Sensors

Optimize your electrical systems with Allegro's current sensors, offering superior accuracy, reliability, and integration for enhanced performance and simplified design. Explore our advanced Hall-effect sensor solutions today!


From Analog to AI: The Sensor Continuum

From Analog to AI: The Sensor Continuum

Sensors are a machine’s interface into our world. Download this white paper to learn how advancements are enabling new applications, increasing automation and productivity.


An In-Depth Look at Panasonic Industry’s Latest Components for Medical Equipment

An In-Depth Look at Panasonic Industry’s Latest Components for Medical Equipment

Access this free technical article to unpack the features and maximize the benefits of Panasonic Industry’s medical equipment components. Discover how these solutions can be leveraged for your next design.


Harwin Flecto Floating Connectors

Harwin Flecto Floating Connectors

Look at the challenges designers face when specifying board-to-board connectors and learn how the latest floating connector technologies address those challenges.


Analog Computing for Artificial Intelligence: How to Perform MAC Operations Using Ohm’s Law

Analog Computing for Artificial Intelligence: How to Perform MAC Operations Using Ohm’s Law

Explore the potential for analog computing to revolutionize the energy landscape for AI systems and present technical considerations for implementing analog MAC operations using a novel Neuromorphic Analog Signal Processing (NASP) technology.


Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.


Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Learn how image sensors using pixel overflow technology provided increased dynamic range and LED flicker mitigation when compared to competing multiple exposure and split-diode exposure technologies. Super-exposure pixels are ideal for demanding automotive applications.


SRAM PUF - The Secure Silicon Fingerprint

SRAM PUF - The Secure Silicon Fingerprint

Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn about the benefits of this groundbreaking technology, which has already been deployed in hundreds of millions of devices, and how it provides robust, flexible, and cost-effective solutions for protecting our connected world.