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Switching Analysis: Testing for Reliability in Power Converter Designs

Switching Analysis: Testing for Reliability in Power Converter Designs

Discover essential reliability testing methods for power converter designs in safety-critical industries like automotive, aerospace, and defense.


Wi-Fi 7 Technology Introduction

Wi-Fi 7 Technology Introduction

IEEE 802.11be (Wi-Fi 7) offers extremely high throughput, lower latency, and higher reliability, with advancements like wider bandwidths and multi-link operation. Explore the key technologies and testing challenges in this comprehensive white paper.


DIN Rail Smart Protection: RACPRO1 E-Fuse Modules

DIN Rail Smart Protection: RACPRO1 E-Fuse Modules

Explore the RACPRO1 e-Fuse series, which offers advanced DC protection with intelligent load current limiting, overload and fault detection, and simplified installation.


Making User-Friendly Products: Overcoming Challenges in the Practical Application of GaN, a Promising Next-Generation Power Semiconductor

Making User-Friendly Products: Overcoming Challenges in the Practical Application of GaN, a Promising Next-Generation Power Semiconductor

In this article, ROHM will discuss the challenges of commercializing GaN power devices, a next-generation power semiconductor expected to improve energy savings and miniaturization in a variety of applications.


Striving for Zero Malfunctions: Behind the Scenes of ROHM’s Ongoing EMC Measures

Striving for Zero Malfunctions: Behind the Scenes of ROHM’s Ongoing EMC Measures

This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.


Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Low-Profile, High-Performance Miniature Encoders for Robotic and Bionic Hands

Learn how Broadcom´s miniature series of reflective encoders can provide accurate positioning feedback to linear actuator systems that are integrated in robotic hand applications.


Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft Accelerates DRC for Advanced IC Designs with Shift-left Verification

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This shift-left approach enhances productivity, simplifies debugging and cuts time-to-market.


Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Three Advantages of MEMS Timing Technology in Industrial Automation Applications

Micro-electro-mechanical systems (MEMS) technology has provided the foundation for transformational change in the electronics industry. In timing components, MEMS technology enables superior performance compared to traditional quartz oscillators in key areas such as greater stability, far higher shock and vibration resistance, higher reliability, and smaller size.


The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

The Promise of Streamlined Production: Implementing Automated Pick-and-Place for Thermal Gap Filler Pads

In this white paper, we will cover what makes gap filler pads a challenge for pick and place manufacturing processes and how to address the specific handling challenges of gap filler pads.


Collaborative Design for MCAD and PCB Designers

Collaborative Design for MCAD and PCB Designers

Download this white paper to learn how to create better products by streamlining collaboration between PCB and mechanical designers.


From Analog to AI: The Sensor Continuum

From Analog to AI: The Sensor Continuum

Sensors are a machine’s interface into our world. Download this white paper to learn how advancements are enabling new applications, increasing automation and productivity.


Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.


Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Super−Exposure Pixel Image Sensors Combat LED Flicker to Improve ADAS Safety

Learn how image sensors using pixel overflow technology provided increased dynamic range and LED flicker mitigation when compared to competing multiple exposure and split-diode exposure technologies. Super-exposure pixels are ideal for demanding automotive applications.


When Planar is Superior to Trench: An In−Depth Look at the Continued Evolution of Silicon Carbide MOSFETs

When Planar is Superior to Trench: An In−Depth Look at the Continued Evolution of Silicon Carbide MOSFETs

Avoid mistakes when transitioning your power applications from silicon to SiC. Understanding current technology limitations and development roadmaps can help you make the right decisions between planar and trench SiC today and tomorrow.


How Automotive Manufacturers Are Managing Risk With Their Image Sensor Suppliers

How Automotive Manufacturers Are Managing Risk With Their Image Sensor Suppliers

Sensors are vital components in today’s modern vehicles, which is why ensuring a well-maintained global supply chain is so important with these devices. This white paper explores the challenges of sensor supply chain management and how an effective manufacturing strategy plays an essential role, making use of a hybrid internal/external manufacturing approach.


How Much Can You Save With a Renewable Load?

How Much Can You Save With a Renewable Load?

Discover how much energy savings a facility can see when switching to a regenerative load.


Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Sign up and access onsemi’s guide to do more with Silicon Carbide solutions.


AFBR-S4 SiPMs in Life Sciences: Overcoming Limitations of PMTs

AFBR-S4 SiPMs in Life Sciences: Overcoming Limitations of PMTs

Discover best-in-class single photon detection with SiPM products that overcome PMT limitations—download the white paper.


The Software-Defined Manufacturing Revolution

The Software-Defined Manufacturing Revolution

Download this eBook to learn about two key technologies driving the future of industrial automation: workload consolidation and time-sensitive networks.


Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Overcoming the Challenges of Silicon Carbide to Ensure Application Success

Silicon Carbide has moved to the front of the pack for offering high efficiency in high power applications. Applications like solar inverters, EV chargers, and others are expected to migrate to SiC to leverage its advantages. This white paper from onsemi examines the challenges inherent in SiC manufacturing, and explains the company’s innovative approach to implementing its SiC process technology.