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Ensure Long Life Code with VTI’s RESTful Driverless Software

Ensure Long Life Code with VTI’s RESTful Driverless Software

Future-Proof Your Test Systems: Discover Driverless Control with VTI’s RESTful Software Traditional driver-based architectures are holding your test systems back—creating costly dependencies and risking obsolescence. Learn how VTI’s RESTful approach delivers platform independence, scalability, and long-term reliability.


Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

This white paper explores the importance of power integrity in PCB design and demonstrates how the Power Analyzer by Keysight, integrated with Altium Designer, helps engineers identify and resolve voltage drop and current density issues early in the design process.


New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

Download the white paper to see how the new COM Express® mini modules deliver maximum Intel® Core™ performance in ultra-compact, rugged edge-computing designs.


COM-HPC® Server Modules: High-Performance Basis for Compact Edge Servers

COM-HPC® Server Modules: High-Performance Basis for Compact Edge Servers

Unlock the full white paper to discover how COM-HPC® Server Modules enable ultra-robust, high-performance edge servers built for harsh environments.


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Discover how Winbond’s low-power memory and Customized Memory Solutions (CMS) advance sustainable, high-performance design for AI, automotive, and industrial applications. Download the white paper to learn more.


onsemi & EBV Image Sensor Portfolio Guide

onsemi & EBV Image Sensor Portfolio Guide

Discover how onsemi image sensors enable smarter machines through advanced imaging for drones, robotics, machine vision, and surveillance.


Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Access Panasonic’s whitepaper to optimize your component choices and build a stronger foundation for the future of medtech.


PCB Modularity — Reuse and Scale

PCB Modularity — Reuse and Scale

This eBook explores how PCB designers can move from one-off designs to scalable systems by rethinking schematics, embracing abstraction, and designing for reuse. Whether you’re an engineer, team lead, or hardware innovator, download this guide to help you design with flexibility, speed, and longevity in mind.


OSM Open Standard Module™ Design Guide

OSM Open Standard Module™ Design Guide

Discover how modular embedded design, powered by MediaTek Genio 510, can power smarter, more connected coffee machines for next-generation appliance development.


From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

From Footfall to Foresight: Revolutionizing Retail Analytics with Real-Time Edge AI

Download the white paper to discover how real-time edge AI is transforming retail analytics with privacy-first, scalable insights.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


SGeT SMARC Design Guide Version 2.2

SGeT SMARC Design Guide Version 2.2

Download ADLINK’s SMARC Design Guide V2.2 for expert insights on scalable, low-power embedded designs for IoT, automation, and edge computing.


Transforming Machine Learning with Alif MCUs

Transforming Machine Learning with Alif MCUs

Download Alif Semiconductor's free white paper today and discover how Alif MCUs are transforming machine learning at the edge!


A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

A Guide to Accelerating Your Design Timeline With Electromagnetic Analysis

Discover how to speed up your design process without sacrificing accuracy using advanced electromagnetic analysis techniques.


Accurate Test Fixture Characterization and De-embedding

Accurate Test Fixture Characterization and De-embedding

This application note offers practical guidance on characterizing and de-embedding lead-in and lead-out structures for accurate measurements of non-connectorized devices using vector network analyzers. It also explains how to export S-Parameter files for use with other test equipment, ensuring precise results across various instruments.


Beyond Batteries: Paving the Way for the Future

Beyond Batteries: Paving the Way for the Future

Download this white paper for a deeper look into power consumption and power management for IoT.


From Analog to AI: The Sensor Continuum

From Analog to AI: The Sensor Continuum

Sensors are a machine’s interface into our world. Download this white paper to learn how advancements are enabling new applications, increasing automation and productivity.


SRAM PUF - The Secure Silicon Fingerprint

SRAM PUF - The Secure Silicon Fingerprint

Discover the cutting-edge IP that is revolutionizing the security of chips and connected devices: SRAM-based Physical Unclonable Functions (SRAM PUFs). Learn about the benefits of this groundbreaking technology, which has already been deployed in hundreds of millions of devices, and how it provides robust, flexible, and cost-effective solutions for protecting our connected world.


Enabling Efficient Multi-Die Design Implementation and IP Integration

Enabling Efficient Multi-Die Design Implementation and IP Integration

Discover how Synopsys integrates UCIe IP and 3DIC Compiler to enable efficient multi-die design implementation and IP integration, addressing the challenges of advanced 2.5D and 3D technologies for high-performance applications like AI, automotive, and mobile.