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CoolSiC™ Automotive Discrete Schottky Diodes

CoolSiC™ Automotive Discrete Schottky Diodes

Explore the features and application benefits of Automotive CoolSiC™ Discrete Schottky Diodes.


Residential Energy Storage Systems (ESS) and Multi-Modular Topology for Second Life Batteries

Residential Energy Storage Systems (ESS) and Multi-Modular Topology for Second Life Batteries

Explore energy storage system solutions that reduce design effort, improve system performance, empower fast time-to-market, and optimize system costs.


5G Voice Over New Radio (VoNR)

5G Voice Over New Radio (VoNR)

In-depth guidance for navigating 5G VoNR in terms of the network deployment and connectivity options to support voice over NR and enable the relevant VoNR data services.


Optimizing Embedded Systems Power Requirements with Hybrid PMIC Design

Optimizing Embedded Systems Power Requirements with Hybrid PMIC Design

Building blocks of modern embedded systems, including processors, SoCs, system DRAM, non-volatile memories, sensors, and connectivity modules, have varied power requirements. On one extreme, a system power management IC (PMIC) integrates all or almost all of the required power rails. On the other hand, individual power rails are implemented using discrete dc/dc and LDOs.


How a High-Resolution D/A Converter Can Help Capture the Sound Quality of a Symphony Orchestra

How a High-Resolution D/A Converter Can Help Capture the Sound Quality of a Symphony Orchestra

This whitepaper dives into the qualities and features of ROHM's latest musical IC ― the MUSIC™ BD34301EKV, a high-resolution audio digital-to-analog converter (DAC). This component, along with an array of others (including a high-fidelity power supply and sound processor), offers the basic building blocks of a Hi-Fi audio device.


Tackling Millimeter-Wave Signal Analysis Challenges

Tackling Millimeter-Wave Signal Analysis Challenges

Overcome challenges in path loss, design margins, and modulation facing millimeter-wave technologies.


TAIYO YUDEN Provides Reliable Filtering in Automotive Applications

TAIYO YUDEN Provides Reliable Filtering in Automotive Applications

This use case from TAIYO YUDEN examines the new communication technologies for today's "Computers on Wheels," the role of RF filtering in automotive TCUs, and the solutions TAIYO YUDEN offers for automotive communications.


TAIYO YUDEN Provides Reliable Filtering in Small Cell 5G Base Stations

TAIYO YUDEN Provides Reliable Filtering in Small Cell 5G Base Stations

This use case from TAIYO YUDEN takes a closer look at how small cell base stations aid faster 5G adoption, the role of RF filtering in 5G wireless connectivity, and how TAIYO YUDEN solutions help provide seamless connectivity in 5G applications.


Integrated Hardened DSP on DAC/ADC ICs Improves Wideband Multichannel Systems

Integrated Hardened DSP on DAC/ADC ICs Improves Wideband Multichannel Systems

This article presents experimental results utilizing a 16-channel transmit and 16-channel receive subarray.


Emerging Data Converter Architectures and Techniques

Emerging Data Converter Architectures and Techniques

This paper discusses several aspects of recent data conversion architectural innovations.


Emerging Automotive In-Cabin Sensing Solutions for Safety and Comfort

Emerging Automotive In-Cabin Sensing Solutions for Safety and Comfort

Explore the key aspects driving the development of in-cabin sensing technologies.


Critical Area Based Test Pattern Optimization

Critical Area Based Test Pattern Optimization

Among the challenges for design-for-test (DFT) engineers is how to set a target metric for automatic test pattern generation (ATPG) and how to choose the best set of patterns. Traditional coverage targets based on the number of faults detected don’t consider the likelihood of one fault occurring compared to another.


Streaming Scan Network: A No-Compromise Approach to DFT

Streaming Scan Network: A No-Compromise Approach to DFT

This white paper describes the basic components of the Tessent Streaming Scan Network (SSN), a technology designed to decouple core level and chip level DFT requirements. With SSN, DFT engineers can for the first time implement DFT using a true, effective bottom-up flow, not having to make trade-offs between implementation effort and manufacturing test cost.


Siemens, AMD, and Microsoft Collaborate on EDA In the Cloud

Siemens, AMD, and Microsoft Collaborate on EDA In the Cloud

This white paper demonstrates how using a production 7nm design, AMD achieved a 2.5X speed up in physical verification cycle time.


New Approaches to Physical Verification Closure and Cloud Computing Come to the Rescue In the EUV Era

New Approaches to Physical Verification Closure and Cloud Computing Come to the Rescue In the EUV Era

This white paper takes a look at how to replace inefficient, less precise verification processes with smarter, more accurate, faster, and more efficient functionality that can improve both the bottom line and product quality.


EDA In the Cloud—Now More Than Ever

EDA In the Cloud—Now More Than Ever

This white paper evaluates the necessity and value of EDA in the cloud while providing a cost-benefit breakdown. Additionally, explore how companies can establish guidelines to ensure that usage is as efficient and cost-effective as possible.


Calibre In the Cloud: Unlocking Massive Scaling and Cost Efficiencies

Calibre In the Cloud: Unlocking Massive Scaling and Cost Efficiencies

This white paper takes a closer look at how cloud processing provides companies the opportunity to reduce time to market and speed up innovation while maintaining or lowering operating costs. This resource also describes what makes Core Calibre technology cloud-ready and its improvements in cloud security that eliminate industry concern over IP protection.


5G: Managing Component-Level Risks for Commercial Success

5G: Managing Component-Level Risks for Commercial Success

Explore the present state of 5G, use cases in each market, and component-level risks during the development of 5G networks.


Connecting the Future of Flight

Connecting the Future of Flight

Read and gain expert insight on the toughest challenges in eVTOL


Comparing Trench and Planar Schottky Rectifiers

Comparing Trench and Planar Schottky Rectifiers

This white paper offers a closer look at the structure and the benefits of Trench Schottky rectifiers. This resource covers topics such as, why Trench rectifiers are typically the correct choice when a better trade-off between forwarding voltage drop and the leakage current is required, why they should also be selected in high power density applications where the ambient temperature is elevated, and what makes them ideal for applications with switching speeds above 100 kHz.