Latest Industry White Papers

Explore the RACPRO1 e-Fuse series, which offers advanced DC protection with intelligent load current limiting, overload…

Explore the RACPRO1 e-Fuse series, which offers advanced DC protection with intelligent load current limiting, overload and fault detection, and simplified installation.

In this article, ROHM will discuss the challenges of commercializing GaN power devices, a next-generation power…

In this article, ROHM will discuss the challenges of commercializing GaN power devices, a next-generation power semiconductor expected to improve energy savings and miniaturization in a variety of applications.

This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.

This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.

This paper discusses how connectivity enables the AIoT, and gives a detailed review of the considerations for AIoT…

This paper discusses how connectivity enables the AIoT, and gives a detailed review of the considerations for AIoT deployment. It explains where Matter fits today and how the Matter approach, which relies on an application layer of standardized protocols, security and semantics, can still benefit verticals that are, as of now, beyond the scope of Matter.

Explore how the Calibre DesignEnhancer (DE) analysis-based, signoff-quality EMIR solution helps design teams achieving…

Explore how the Calibre DesignEnhancer (DE) analysis-based, signoff-quality EMIR solution helps design teams achieving both Design Rule Check (DRC) clean layouts and optimal electrical performance.

Access this whitepaper to get in-depth insights and solutions. Get a head start on the future of automotive applications…

Access this whitepaper to get in-depth insights and solutions. Get a head start on the future of automotive applications with Taiyo Yuden.

Edge servers are essential for fast, reliable data processing across industries, but their performance depends on storage…

Edge servers are essential for fast, reliable data processing across industries, but their performance depends on storage solutions that manage heat and sustain efficiency. Download the white paper now to discover how to optimize your edge infrastructure.

Learn how Broadcom´s miniature series of reflective encoders can provide accurate positioning feedback to linear…

Learn how Broadcom´s miniature series of reflective encoders can provide accurate positioning feedback to linear actuator systems that are integrated in robotic hand applications.

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as…

Head-up displays (HUDs) allow drivers to maintain their focus on the road while still accessing important data such as speed, navigation instructions, and vehicle status by projecting information directly onto the windshield.

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss…

Learn about three key indicators of semiconductor process technology: power, performance, and area (PPA). We will discuss the trade-offs between these indicators and how the PPA metric supports the comparison of analog capabilities across different processes. Finally, using the PPA figure of merit, it is shown that the onsemi 65 nm BCD Treo platform provides at least a 5x integral improvement on average over older 180 nm technologies.

Download this white paper for a deeper look into power consumption and power management for IoT.

Download this white paper for a deeper look into power consumption and power management for IoT.

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact,…

Winbond CUBE addresses the increasing demand for AI applications by providing a high-bandwidth, power-efficient, compact, and cost-effective memory solution.

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters,…

This application note provides guidance on optimizing Error Vector Magnitude (EVM) measurements for WLAN transmitters, specifically focusing on the IEEE 802.11be standard (Wi-Fi 7). It outlines key features such as increased channel bandwidth, advanced modulation schemes, and multi-link operation, which aim to enhance throughput and reduce latency in wireless communication systems.

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation,…

Discover the latest advancements and challenges in OTH radar technology, including insights into HF propagation, interference sources, and systems like US ROTHR and Australia's JORN.

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity,…

This application card highlights the importance of analyzing high-speed datacom interfaces for signal integrity, addressing the challenges posed by connecting these interfaces to oscilloscopes. It showcases how oscilloscopes with advanced jitter options can effectively analyze jitter contributions and assess the impact of test fixtures and traces on measurement accuracy.

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications.…

Onboard chargers (OBCs) and DC-DC converters in EVs demand high performance but are also cost-sensitive applications. This white paper investigates onsemi’s M3S 650V SiC MOSFET technology for high-speed switching power applications in electric vehicles and other energy-efficient systems.

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local…

Microsoft accelerates IC design verification with Siemens' Calibre nmDRC Recon, reducing runtimes by focusing on local checks earlier in the flow. This shift-left approach enhances productivity, simplifies debugging and cuts time-to-market.

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule…

When designing robust SiC power modules, it is critical to consider package inductance, die−level mismatch, and Joule heating. This paper investigates these key characteristics, demonstrates the effectiveness of simulation tools in modeling SiC power module performance, and proposes mitigation measures to further improve reliability.

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies…

Download this exclusive poster for a clear visual overview of 5G infrastructure. Discover key concepts and technologies shaping 5G — perfect for your lab or personal workspace!