Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.
July 26, 2022 by Siemens Digital Industries Software
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.
July 26, 2022 by Siemens Digital Industries Software
The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data collected with either the NGL, NGM or NGU power supplies from Rohde & Schwarz. This application note explores the prerequisites needed, interfaces, settings, order information, and more.
July 20, 2022 by Rohde & Schwarz
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. Understanding the cost/ benefit relationship of cloud computing helps companies determine the optimal configuration that provides the greatest returns.
April 25, 2022 by Siemens Digital Industries Software
In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.
April 12, 2022 by Siemens Digital Industries Software
MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper explores how electronics and sensors are powering today's connected vehicles.
March 08, 2022 by Murata
This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design.
March 01, 2022 by Siemens Digital Industries Software