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Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

Understanding Power Integrity in PCB Design: Power Analyzer by Keysight

This white paper explores the importance of power integrity in PCB design and demonstrates how the Power Analyzer by Keysight, integrated with Altium Designer, helps engineers identify and resolve voltage drop and current density issues early in the design process.


Securing Cellular IoT: Built-in Protection for Connected Devices, from Chip to Cloud

Securing Cellular IoT: Built-in Protection for Connected Devices, from Chip to Cloud

Secure your cellular IoT devices from chip to cloud with built-in protection that simplifies onboarding, strengthens security, and scales with your connected ecosystem.


New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

New Performance Boost: COM Express® mini with 13th Generation Intel® Core™ Technology

Download the white paper to see how the new COM Express® mini modules deliver maximum Intel® Core™ performance in ultra-compact, rugged edge-computing designs.


COM-HPC® Server Modules: High-Performance Basis for Compact Edge Servers

COM-HPC® Server Modules: High-Performance Basis for Compact Edge Servers

Unlock the full white paper to discover how COM-HPC® Server Modules enable ultra-robust, high-performance edge servers built for harsh environments.


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Discover how Winbond’s low-power memory and Customized Memory Solutions (CMS) advance sustainable, high-performance design for AI, automotive, and industrial applications. Download the white paper to learn more.


Industrial Wireless Solutions: The Ultimate Wi-Fi 7 Solutions for Industrial Innovation

Industrial Wireless Solutions: The Ultimate Wi-Fi 7 Solutions for Industrial Innovation

Download the eBook to discover how Advantech’s Wi-Fi 7 solutions are driving industrial connectivity and accelerating AIoT innovation.


onsemi & EBV Image Sensor Portfolio Guide

onsemi & EBV Image Sensor Portfolio Guide

Discover how onsemi image sensors enable smarter machines through advanced imaging for drones, robotics, machine vision, and surveillance.


Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Electronics in Medical Equipment: Component Choices Driven by Forces of Regulation, Miniaturization and Data Sharing

Access Panasonic’s whitepaper to optimize your component choices and build a stronger foundation for the future of medtech.


Guide to Requirements Management for Modern Electronics Teams

Guide to Requirements Management for Modern Electronics Teams

Learn how to bring structure and traceability to complex electronics projects. This guide explores best practices and tools for modern requirements management to help teams reduce errors, improve collaboration, and accelerate delivery.


From Stationary Arms to Humanoids: The Journey of Mobile Robotics

From Stationary Arms to Humanoids: The Journey of Mobile Robotics

Access this whitepaper to explore key advancements and challenges in robotics, from stationary robotic arms to a new generation of humanoid, agile, and versatile robots.


OSM Open Standard Module™ Design Guide

OSM Open Standard Module™ Design Guide

Discover how modular embedded design, powered by MediaTek Genio 510, can power smarter, more connected coffee machines for next-generation appliance development.


Selecting the Right Embedded Hardware – A Guide for Developers

Selecting the Right Embedded Hardware – A Guide for Developers

Discover how to choose the right embedded platform using this white paper from NXP.


COMExpress vs COM-HPC

COMExpress vs COM-HPC

Developers of computer systems can choose between the two platforms, COM Express and COM-HPC. But which is the right one? Download the white paper to learn more!


SGeT SMARC Design Guide Version 2.2

SGeT SMARC Design Guide Version 2.2

Download ADLINK’s SMARC Design Guide V2.2 for expert insights on scalable, low-power embedded designs for IoT, automation, and edge computing.


Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

Secure by Design, Compliant by Default: Navigating the Cyber Resilience Act with NXP and Digi

The Cyber Resilience Act (CRA) significantly reshapes the global product compliance landscape by embedding strict cybersecurity obligations into the framework for Conformité Européenne (CE) marking. These requirements potentially impact any OEM product, regardless of origin, that is intended to be sold in the EU. Formally known as Regulation (EU) 2024/2847, the CRA applies to any product containing digital elements whose intended purpose or foreseeable use includes a direct or indirect data connection — either logically or physically — to a network or device. This hands-on guide from Digi and NXP provides a walkthrough of the requirements and how to comply. Under this regulation, all products that are capable of connecting to a device or network must meet defined cybersecurity requirements in order to receive CE marking, which is a legal prerequisite for sale within the EU. Products that do not comply cannot be placed on the EU market. At the heart of the CRA is a response to persistent cybersecurity shortcomings. Although many products claim to be secure, there is often no reliable way for consumers or businesses to verify such claims or to ensure ongoing protection. The CRA provides a unified, mandatory framework for cybersecurity compliance that spans the entire product lifecycle.


RRAM — Transforming Memory Solutions for AI-Driven IoT Devices and Embedded Systems

RRAM — Transforming Memory Solutions for AI-Driven IoT Devices and Embedded Systems

Unlock the Power of High-Performance Memory Solutions


Using Mixed Signal Oscilloscopes to Find and Diagnose Jitter Caused by Power Integrity Problems

Using Mixed Signal Oscilloscopes to Find and Diagnose Jitter Caused by Power Integrity Problems

This guide explores how power integrity issues affect signal jitter and shows how mixed signal oscilloscopes can pinpoint and resolve root causes.


Meeting the European Union’s Radio Equipment Directive (RED) Cybersecurity Standards

Meeting the European Union’s Radio Equipment Directive (RED) Cybersecurity Standards

Winbond’s W77Q and W77T secure flash devices offer manufacturers a simple, effective path to compliance with the latest cybersecurity standards under the Radio Equipment Directive.


Transforming Machine Learning with Alif MCUs

Transforming Machine Learning with Alif MCUs

Download Alif Semiconductor's free white paper today and discover how Alif MCUs are transforming machine learning at the edge!


Accurate Test Fixture Characterization and De-embedding

Accurate Test Fixture Characterization and De-embedding

This application note offers practical guidance on characterizing and de-embedding lead-in and lead-out structures for accurate measurements of non-connectorized devices using vector network analyzers. It also explains how to export S-Parameter files for use with other test equipment, ensuring precise results across various instruments.