This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.
This article introduces EMC measures for semiconductors – crucial for ensuring the safe operation of electronic devices.
Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along…
Download this white paper to learn about the timing, power, and physical signoffchallenges of multi-die designs, along with advanced electronic design automation (EDA) solutions available today.
Explore the features that make the EA-PSB 10000 – a programmable, autoranging, bidirectional DC power source – the…
Explore the features that make the EA-PSB 10000 – a programmable, autoranging, bidirectional DC power source – the ideal solution for LV123 testing for HEV and EV applications.
Get an introduction to error vector magnitude (EVM); the primary metric of modulation accuracy.
Get an introduction to error vector magnitude (EVM); the primary metric of modulation accuracy.
Leverage New Technologies with High-Power AC Sources
Leverage New Technologies with High-Power AC Sources
Analog Devices offers simultaneous sampling ADCs to monitor both voltages and current, simplifying the power calculations…
Analog Devices offers simultaneous sampling ADCs to monitor both voltages and current, simplifying the power calculations of dual, quad, or octal devices.
Explore EMI challenges associated with migrating a design from Si to SiC, test tools and test methodology, along with…
Explore EMI challenges associated with migrating a design from Si to SiC, test tools and test methodology, along with mitigation and optimization techniques.
Ensure correct-by-construction filler cell insertion in less time, while using standard industry interfaces that…
Ensure correct-by-construction filler cell insertion in less time, while using standard industry interfaces that seamlessly integrate with both the P&R and physical verification tools.
Mitigating Cross-Fabric Thermal and Stress Barriers to 3D-ICs
Mitigating Cross-Fabric Thermal and Stress Barriers to 3D-ICs
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available…
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. Understanding the cost/ benefit relationship of cloud computing helps companies determine the optimal configuration that provides the greatest returns.
As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool…
As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design teams to rapidly examine dirty and immature designs to find and fix high-impact circuit errors earlier and faster, leading to an overall reduction in tapeout schedules and time to market.
Modern society is underpinned by electronics and electrical machines – it’s hard to imagine life without the myriad…
Modern society is underpinned by electronics and electrical machines – it’s hard to imagine life without the myriad of devices that keep us productive, comfortable, informed and entertained, both at home and in business. The development of new semiconductor technologies provide the right mix of features for current and emerging power conversion applications.
In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software…
In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software development.
This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for…
This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design.
Accelerate IC release-to-market and enhance customer experience with this white paper
Accelerate IC release-to-market and enhance customer experience with this white paper
Learn from this panel of experts addressing artificial intelligence's impact on the on the semiconductor industry,…
Learn from this panel of experts addressing artificial intelligence's impact on the on the semiconductor industry, specifically, chip design verification.
Learn how to create a new verification flow that combines emulation and X STEP, a platform that can generate, capture,…
Learn how to create a new verification flow that combines emulation and X STEP, a platform that can generate, capture, and analyze bit-accurate fronthaul traffic.
This paper describes how a PreScan, Veloce, and AMEsim tool flow provides the thoroughness of verification to get new…
This paper describes how a PreScan, Veloce, and AMEsim tool flow provides the thoroughness of verification to get new cars on the road quickly, efficiently, and safely.
Explore the advantages and benefits of Veloce VirtuaLAB emulation, backed up by three test cases.
Explore the advantages and benefits of Veloce VirtuaLAB emulation, backed up by three test cases.
This pocket guide evaluates these aspects as well as important considerations in making accurate power rail measurements…
This pocket guide evaluates these aspects as well as important considerations in making accurate power rail measurements and how impedance measurements can help to detect typical root causes of power integrity issues.