The trends in industrial applications, their challenges and the TE Connectivity solutions that meet these evolving requirements.
The trends in industrial applications, their challenges and the TE Connectivity solutions that meet these evolving requirements.
Characteristics and driving recommendations for SiC MOSTFETs and modules.
Characteristics and driving recommendations for SiC MOSTFETs and modules.
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also…
Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is…
Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.
The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data…
The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data collected with either the NGL, NGM or NGU power supplies from Rohde & Schwarz. This application note explores the prerequisites needed, interfaces, settings, order information, and more.
Working with the Edge Impulse team, Advantech developed a monitoring system that flags even tiny delays, for more precise…
Working with the Edge Impulse team, Advantech developed a monitoring system that flags even tiny delays, for more precise fine-tuning with less human oversight.
Learn how Edge Impulse's RAM-1 helped Izoelektro build one of the most advanced power grid monitoring systems in the world.
Learn how Edge Impulse's RAM-1 helped Izoelektro build one of the most advanced power grid monitoring systems in the world.
NEW tech paper - automated scalable power integrity analysis tool for analog designs
NEW tech paper - automated scalable power integrity analysis tool for analog designs
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available…
Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. Understanding the cost/ benefit relationship of cloud computing helps companies determine the optimal configuration that provides the greatest returns.
In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized…
In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.
In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software…
In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software development.
MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper…
MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper explores how electronics and sensors are powering today's connected vehicles.
This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for…
This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design.
In this industry white paper with The Qt Company, keep up with the latest trends in user interface (UI) and user…
In this industry white paper with The Qt Company, keep up with the latest trends in user interface (UI) and user experience (UX) for smart appliances.
Learn the fundamentals of beamforming theory for phased array systems and its implementation in Xilinx Zynq®…
Learn the fundamentals of beamforming theory for phased array systems and its implementation in Xilinx Zynq® UltraScale+™ RFSoC.
This white paper examines the benefits of using Xilinx-based SoC module solutions.
This white paper examines the benefits of using Xilinx-based SoC module solutions.
In this Guide, learn the best practices for embedded development in 2021 from setting the scope to selecting the hardware…
In this Guide, learn the best practices for embedded development in 2021 from setting the scope to selecting the hardware & software stack.
Learn from this panel of experts addressing artificial intelligence's impact on the on the semiconductor industry,…
Learn from this panel of experts addressing artificial intelligence's impact on the on the semiconductor industry, specifically, chip design verification.
Learn how to increase innovation and drive growth by modernizing digital product delivery.
Learn how to increase innovation and drive growth by modernizing digital product delivery.
This white paper discusses how verification and validation bring the design of future cars to the present day.
This white paper discusses how verification and validation bring the design of future cars to the present day.
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