Latest Embedded Industry White Papers

Swissbit Data Center SSDs offer a radical new approach to improve performance, latency, and endurance over the lifetime…

Swissbit Data Center SSDs offer a radical new approach to improve performance, latency, and endurance over the lifetime of the SSD, and thus the quality of service and total cost of ownership.

Security engineering expertise, proven processes and understanding of emerging trends to deliver trusted solutions that…

Security engineering expertise, proven processes and understanding of emerging trends to deliver trusted solutions that meet industrial security needs.

Learn more about sensor and connectivity technologies, which need to be identified before choosing a suitable…

Learn more about sensor and connectivity technologies, which need to be identified before choosing a suitable architecture for a predictive maintenance system.

Review the embedded image sensor technology that is employed in applications that use imaging.

Review the embedded image sensor technology that is employed in applications that use imaging.

This application note describes the structure and design philosophy of onsemi High-Side SmartFETs, and provides specific…

This application note describes the structure and design philosophy of onsemi High-Side SmartFETs, and provides specific examples and numerical calculations of how to apply SmartFETs with analog current sense into your system to achieve the optimal switching performance.

Download this eGuide to receive step-by-step instructions for selecting the right probe and using advanced techniques to…

Download this eGuide to receive step-by-step instructions for selecting the right probe and using advanced techniques to improve overall measurement accuracy.

The trends in industrial applications, their challenges and the TE Connectivity solutions that meet these evolving requirements.

The trends in industrial applications, their challenges and the TE Connectivity solutions that meet these evolving requirements.

Characteristics and driving recommendations for SiC MOSTFETs and modules.

Characteristics and driving recommendations for SiC MOSTFETs and modules.

Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also…

Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is…

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.

The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data…

The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data collected with either the NGL, NGM or NGU power supplies from Rohde & Schwarz. This application note explores the prerequisites needed, interfaces, settings, order information, and more. 

Working with the Edge Impulse team, Advantech developed a monitoring system that flags even tiny delays, for more precise…

Working with the Edge Impulse team, Advantech developed a monitoring system that flags even tiny delays, for more precise fine-tuning with less human oversight.

Learn how Edge Impulse's RAM-1 helped Izoelektro build one of the most advanced power grid monitoring systems in the world.

Learn how Edge Impulse's RAM-1 helped Izoelektro build one of the most advanced power grid monitoring systems in the world.

NEW tech paper - automated scalable power integrity analysis tool for analog designs

NEW tech paper - automated scalable power integrity analysis tool for analog designs

Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available…

Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. Understanding the cost/ benefit relationship of cloud computing helps companies determine the optimal configuration that provides the greatest returns.

In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized…

In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.

In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software…

In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software development.

MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper…

MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper explores how electronics and sensors are powering today's connected vehicles.

This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for…

This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design.