This whitepaper dives into the qualities and features of ROHM's latest musical IC ― the MUSIC™ BD34301EKV, a high-resolution audio digital-to-analog converter (DAC). This component, along with an array of others (including a high-fidelity power supply and sound processor), offers the basic building blocks of a Hi-Fi audio device.
June 22, 2021 by ROHM Semiconductor
Among the challenges for design-for-test (DFT) engineers is how to set a target metric for automatic test pattern generation (ATPG) and how to choose the best set of patterns. Traditional coverage targets based on the number of faults detected don’t consider the likelihood of one fault occurring compared to another.
June 17, 2021 by Siemens Digital Industries Software
This white paper describes the basic components of the Tessent Streaming Scan Network (SSN), a technology designed to decouple core level and chip level DFT requirements. With SSN, DFT engineers can for the first time implement DFT using a true, effective bottom-up flow, not having to make trade-offs between implementation effort and manufacturing test cost.
June 17, 2021 by Siemens Digital Industries Software
This white paper takes a look at how to replace inefficient, less precise verification processes with smarter, more accurate, faster, and more efficient functionality that can improve both the bottom line and product quality.
June 09, 2021 by Siemens Digital Industries Software
This white paper evaluates the necessity and value of EDA in the cloud while providing a cost-benefit breakdown. Additionally, explore how companies can establish guidelines to ensure that usage is as efficient and cost-effective as possible.
June 09, 2021 by Siemens Digital Industries Software
This white paper describes a flexible USB4-based IP solution for edge AI accelerators and SoCs. The IP solution can be used with multiple types of hosts by supporting legacy PCIe 4.0, USB4, USB 3.x, and USB 2.0 connections.
May 12, 2021 by Synopsys
This paper provides an overview of the key characteristics of ON Semiconductor Gen 1 1200 V SiC MOSFETs and how they can be influenced by the driving conditions. This resource also provides a guideline on the usage of the NCP51705 an isolated gate driver for SiC MOSFETs.
May 07, 2021 by onsemi
Some engineers believe that the 2D design is no longer sufficient for today’s complicated PCB layouts. Flex and rigid-flex designs, and an increasing need for collaboration with MCAD, require advanced 3D layout design capabilities to address today’s challenges fully.
May 04, 2021 by Siemens Digital Industries Software
A new metric for SerDes channel and package characterization is emerging. Effective Return Loss (ERL) is replacing the traditional frequency-domain Return Loss (RL) metric as a more effective means of characterizing SerDes channels.
May 04, 2021 by Siemens Digital Industries Software
Identifying the right medical solutions for imaging, diagnostics, and clinical equipment is not easy. The growing needs of scalable healthcare platforms with heterogeneous multi-processing, I/O flexibility, hardware-based deterministic controls, and comprehensive solutions in healthcare artificial intelligence (AI), medical imaging, and safety & security add quite a bit of complexity to the decision process.
April 28, 2021 by Avnet
One thing is clear — tapeouts are getting harder and taking longer. According to statistics from industry conference surveys, at least 50% of scheduled tapeouts slip each year.
March 30, 2021 by Siemens Digital Industries Software
Accurately extracting and calculating the common resistance of interconnects within analog IC designs is fundamental for evaluating circuit reliability, particularly for noise and voltage drop analysis and ESD protection verification.
March 30, 2021 by Siemens Digital Industries Software
Layout versus schematic (LVS) verification is an essential and integral part of integrated circuit (IC) verification in a system-on-chip (SoC) design cycle, but with today’s highly dense and hierarchical layouts, increasing circuit complexity, and intricate foundry rules, running LVS can be a time-consuming and resource-intensive endeavor.
March 23, 2021 by Siemens Digital Industries Software
The monitoring and testing of a DAC signal chain are critical considerations for open-loop applications. Errors in a DAC signal chain, including DAC intrinsic errors that vary depending on the system, can significantly disrupt the customer design-in experience.
March 23, 2021 by Analog Devices
Whether used for a process control installation or an industrial automation system, an I/O module (or a field junction box) poses a host of unique challenges in a product's life cycle. Product management, for example, faces key decisions on how many channels and which combinations will be necessary for each product.
February 23, 2021 by Analog Devices