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Microchip SiC Power Solutions Guide

Microchip SiC Power Solutions Guide

Using this comprehensive guide, engineers will feel confident to switch to Silicon Carbide (SiC). They can leverage SiC's low switching losses, improved system efficiency, high power density in a smaller footprint, 3x superiority to silicon in thermal conduction, and many other benefits. Download your copy here!


EMC Standards - Overview 5.0

EMC Standards - Overview 5.0

The number of EMC standards published is steadily increasing. In this white paper by Rohde & Schwarz, explore basic standards, generic standards, and product/product family standards.


SiC MOSFETs: Gate Drive Optimization

SiC MOSFETs: Gate Drive Optimization

For high−voltage switching power applications, silicon carbide or SiC MOSFETs bring notable advantages compared to traditional silicon MOSFETs and IGBTs.


Fast DC EV Charging: Common Topologies and Power Devices Used in the System

Fast DC EV Charging: Common Topologies and Power Devices Used in the System

Common Topologies and Power Devices Used in the System for Fast DC EV Charging.


Performance Comparison of 1200 V SiC MOSFET and Si IGBT Used in Power Integrated Module for 1100 V Solar Boost Stage

Performance Comparison of 1200 V SiC MOSFET and Si IGBT Used in Power Integrated Module for 1100 V Solar Boost Stage

Compare the performance of two power integrated modules (PIMs) in the boost stage of an 1100 V solar inverter.


onsemi M 1 1200 V SiC MOSFETs & Modules: Characteristics and Driving Recommendations

onsemi M 1 1200 V SiC MOSFETs & Modules: Characteristics and Driving Recommendations

Characteristics and driving recommendations for SiC MOSTFETs and modules.


Over-the-Air RF Conformance Measurements on 5G NR Devices

Over-the-Air RF Conformance Measurements on 5G NR Devices

Learn more about the technical background for over-the-air (OTA) testing on 5G NR devices.


Space-based Design— Challenges, Use Case, and Choosing the Right Connectors

Space-based Design— Challenges, Use Case, and Choosing the Right Connectors

Learn how to choose the right connectors for space exploration systems that can handle extreme environments.


Deliver 3D IC Innovations Faster

Deliver 3D IC Innovations Faster

Heterogeneous IC integration is an inflection point that’s not only bringing new architectures into the market but also disrupting the engineering process. How Siemens 3D IC helps you engineer a smarter future faster.


System-level Connectivity Management and Verification of 3D IC Heterogeneous Assemblies

System-level Connectivity Management and Verification of 3D IC Heterogeneous Assemblies

Capturing the intended system-level connectivity in a multi-substrate 3D IC assembly can be a challenge. This is especially true when each substrate is built using a different methodology, team, and/or format.


Power Consumption Analysis Tool

Power Consumption Analysis Tool

The power consumption analysis tool was developed to make it easier for customers to analyze power consumption data collected with either the NGL, NGM or NGU power supplies from Rohde & Schwarz. This application note explores the prerequisites needed, interfaces, settings, order information, and more. 


Receiver Testing: Why Test Signal Quality Matters

Receiver Testing: Why Test Signal Quality Matters

This educational note provides performance parameters to consider when evaluating signal generators for your receiver testing. This will ensure that the signal generator provides a level of performance that has minimal effect on your receiver measurements.


Understanding Phase Noise Fundamentals

Understanding Phase Noise Fundamentals

This white paper provides a brief technical introduction to phase noise concepts as well as an overview of how phase noise is measured and reported.


Shorten the time between P&R and physical verification with Calibre PVReady filler cell solution

Shorten the time between P&R and physical verification with Calibre PVReady filler cell solution

Ensure correct-by-construction filler cell insertion in less time, while using standard industry interfaces that seamlessly integrate with both the P&R and physical verification tools.


Improving the Capabilities of Cognitive Radar and EW Systems

Improving the Capabilities of Cognitive Radar and EW Systems

Unveil the challenges that mode-agile radar and EW threat emitters pose to traditional static threat library implementations in radar and EW systems, and consider the architecture of cognitive artificial intelligence (AI) and machine learning (ML) systems that can be used to deliver effective RF countermeasures. This whitepaper also explains how a wideband RF record, simulation and playback system can be used to train the AI/ML engines, and evaluates the responses and effectiveness of those countermeasures on real hardware.


Emerging Trends in Wireless Infrastructure

Emerging Trends in Wireless Infrastructure

5G is a transformational technology designed to provide significant flexibility and support for a variety of use cases. In this white paper, we describe the emerging infrastructure trends of wireless networks for 4G, 5G, and beyond 5G.


Key Characteristics of Programmable DC Power Supplies

Key Characteristics of Programmable DC Power Supplies

This whitepaper dives into the various characteristics of programmable power supplies and how these may benefit users in the modern R&D and production test environment working with transistors, ICs, and op amp circuits as well as solar batteries, rechargeable batteries, and fuel cells. It also discusses how the PWX power supplies offered by Kikusui meet the needs of these applications.


White Paper: Evolving Your ADAS and AV Tests with Emulation Capabilities

White Paper: Evolving Your ADAS and AV Tests with Emulation Capabilities

Miniaturized radar target simulators (mRTS) enable design and test engineers to emulate complete traffic scenes to train their ADAS and autonomous driving algorithms.


Overcoming Product Lifecycle Challenges

Overcoming Product Lifecycle Challenges

Overcoming Product Lifecycle Challenges: From development to sustainment, the 5 P’s every plan should include.


Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Mitigating Cross-Fabric Thermal and Stress Barriers to 3D-ICs