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Reliability Verification in the Cloud Delivers Significant Runtime Benefits

Reliability Verification in the Cloud Delivers Significant Runtime Benefits

Design complexities and time-to-market pressures compel companies to find innovative ways to leverage all available resources. Understanding the cost/ benefit relationship of cloud computing helps companies determine the optimal configuration that provides the greatest returns.


Accelerate time to market with Calibre nmLVS Recon technology: A new paradigm for circuit verification

Accelerate time to market with Calibre nmLVS Recon technology: A new paradigm for circuit verification

As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS Recon tool enables design teams to rapidly examine dirty and immature designs to find and fix high-impact circuit errors earlier and faster, leading to an overall reduction in tapeout schedules and time to market.


Steer Toward Full Vehicle Autonomy with Confidence

Steer Toward Full Vehicle Autonomy with Confidence

Sharpen your ADAS radar vision with full-scene emulation


FLIR RS6780 Long Range and Scientific MWIR Camera

FLIR RS6780 Long Range and Scientific MWIR Camera

The FLIR RS6780 offers advanced detector, triggering, and synchronization capabilities in an environmentally protected package.


Simulating Solar Cells

Simulating Solar Cells

This resource note discusses how using a power supply instead of a solar cell provides a controlled, repeatable output for testing solar inverters. The application note also goes over how to use an EA-PSB 10000 series bidirectional power supply to simulate solar cells.


Five key workflows that deliver 3D IC packaging success

Five key workflows that deliver 3D IC packaging success

Several factors are converging and driving the chiplet design revolution. This paper explores these factors and outlines five key workflows that address and manage the associated, new challenges. The paper recommends workflow adoption focus areas that provide immediate heterogeneous integration capability benefits while establishing a managed methodology adoption and migration process that minimizes disruption, risk, and cost. This will bring heterogeneous integration-based chiplet design within reach of the mainstream instead of being accessible only to the mega iDMs and fabless semiconductor companies.


Proposed standardization of chiplet models for heterogenous integration

Proposed standardization of chiplet models for heterogenous integration

In this paper by Siemens, the authors, as members of the Chiplet Design Exchange (CDX), propose a set of standardized chiplet models that include thermal, physical, mechanical, IO, behavioral, power, signal and power integrity, electrical properties, and test models, as well as documentation to facilitate the integration of the chiplets into a design. Additionally, security traceability assurance is an emerging need to ensure trusted supply chain and operational security of the chiplets and the resulting packaged devices. It is strongly recommended that these models are electronically readable for use in the design work flows.


EMC Basics: Common Mode vs. Differential Noise

EMC Basics: Common Mode vs. Differential Noise

Today, we will talk about the differences between common mode and differential noise in EMC and how to combat them.


IoT Design Guide – Antenna Design, Measurement and Optimization

IoT Design Guide – Antenna Design, Measurement and Optimization

IoT applications using wireless networks rely on the performance of wireless interfaces. Our eGuide helps you select, integrate and optimize the most suitable antenna for optimal performance. It will also highlight factors affecting antenna performance, from coverage and range to noise and interference – and much more.


IoT Cybersecurity Simplified Using Security Automation Tools

IoT Cybersecurity Simplified Using Security Automation Tools

Learn how BG Networks Security Automation Tools (BGN-SAT) can be used to implement IoT cybersecurity in a very short amount of time, by any embedded developer, from those who are new to cybersecurity to those who are experts.


New semiconductor technologies are driving higher efficiency in power conversion

New semiconductor technologies are driving higher efficiency in power conversion

Modern society is underpinned by electronics and electrical machines – it’s hard to imagine life without the myriad of devices that keep us productive, comfortable, informed and entertained, both at home and in business. The development of new semiconductor technologies provide the right mix of features for current and emerging power conversion applications.


Circuit protection with SiC FETs in dual-gate configuration

Circuit protection with SiC FETs in dual-gate configuration

In this white paper, we examine the use of normally-off SiC FETs in a dual-gate configuration to simplify the development of high current DC and AC circuit breakers.


Autoranging DC Power Supplies

Autoranging DC Power Supplies

Programmable DC power sources are an essential tool in product development and production testing of a wide range of electronic devices and systems. In many instances, functional test requires submitting the device-under-test (DUT) to a wide range of operating conditions. In some cases, the DUT draws constant power under variable input conditions.


Antenna Design and Testing for Advanced 5G and mmWave Applications

Antenna Design and Testing for Advanced 5G and mmWave Applications

This eBook deals with some of the critical challenges and solutions that have risen to the forefront of 5G-related technology.


Veloce ProFPGA Increases Design Efficiency and Brings SoCs to Market Faster

Veloce ProFPGA Increases Design Efficiency and Brings SoCs to Market Faster

In this white paper, the Siemens EDA tool provides a modular, scalable desktop prototyping platform for early software development.


Crafting the Next Generation of Vehicles and Mobility Experiences with Automotive Electronics

Crafting the Next Generation of Vehicles and Mobility Experiences with Automotive Electronics

MaaS is driving the need to add and improve features that support the heart of this new technology. This white paper explores how electronics and sensors are powering today's connected vehicles.


Thermal Management for BEVs with TDK Sensor Solutions Optimized by Computer-Aided Modeling

Thermal Management for BEVs with TDK Sensor Solutions Optimized by Computer-Aided Modeling

The move to e-mobility comes with significant demands. Using electricity exclusively for both motive power and auxiliary features introduces entirely new electromechanical architectures and sub-systems into the automotive domain.


Veloce prototyping solutions accelerate verification of HPC AI-enabled SoCs

Veloce prototyping solutions accelerate verification of HPC AI-enabled SoCs

This white paper explores the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design.


What You Need to Know About EMC Losses

What You Need to Know About EMC Losses

EMC, or electromagnetic compatibility, is a critical part of developing electronic devices to make sure they will perform properly and meet standards. An important part of EMC is understanding the losses that occur and knowing how to calculate and control them – all of which we will explain in this article.


TAIYO YUDEN Power Inductors for Industrial Robotics

TAIYO YUDEN Power Inductors for Industrial Robotics

Automated, programmable robots continue to improve in an era of smart manufacturing. Read this one-pager from TAIYO YUDEN to learn more about developments in power inductors for today's industrial robotics applications