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Understanding How Laminated Cores Reduce Eddy Current Loss

Understanding How Laminated Cores Reduce Eddy Current Loss

Eddy currents are a major loss mechanism in transformer cores. This article provides both in-depth and simplified explanations of how core laminations work to mitigate the effects of eddy currents.


Op Amps From ST, TI, and Rohm Vault Analog Design Challenges

Op Amps From ST, TI, and Rohm Vault Analog Design Challenges

Analog designers rejoice! ST, TI, and Rohm have released new op amps to address unique analog pain points.


News Jul 05, 2024 by Aaron Carman
Seymour Cray and the Dawn of Supercomputing

Seymour Cray and the Dawn of Supercomputing

Seymour Cray once dreamed of building the fastest computer in the world. In a 30-year span, the "father of supercomputing" accomplished that goal several times over.


News Jul 04, 2024 by Biljana Ognenova
Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Intel claims the optical compute interconnect chiplet will "revolutionize high-speed data processing" of AI loads in data centers and HPC.


News Jul 03, 2024 by Jake Hertz
Creating a Parallel-Load Shift Register in LTspice

Creating a Parallel-Load Shift Register in LTspice

We explore the design and functionality of a digital shift register intended for use in mixed-signal circuit simulations.


Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Semiconductor is bringing cryptographic agility and hardware root of trust to low-power FPGAs.


News Jul 02, 2024 by Duane Benson
Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

"Dynamite comes in small packages": Gowin Semiconductor adopts this mentality with its new FPGA targeting embedded high-speed interfaces.


News Jul 02, 2024 by Aaron Carman
5G and IoT: What Will It Take for Them to Get Along?

5G and IoT: What Will It Take for Them to Get Along?

5G and IoT seem perfect together—large network capacity meets billions of connected devices. Thomas Keller of u-blox discusses competing technical and economic goals that make this a troubling marriage and identifies new developments that might provide a path forward.


Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

The new funding will expand the company’s product offerings and align it with the generative AI movement.


News Jul 01, 2024 by Jake Hertz
Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

The new microcontroller adds robust wireless connectivity and offloading to bolster the host processor.


News Jul 01, 2024 by Jake Hertz
Hysteresis Loss: Estimation, Modeling, and the Steinmetz Equation

Hysteresis Loss: Estimation, Modeling, and the Steinmetz Equation

The hysteresis effect is one of the main sources of loss in ferromagnetic materials. In this article, we learn to calculate the hysteresis loss of a magnetic core and work through some example problems.


Siemens LOGO!Power Miniature Power Supplies | New Product Brief

Siemens LOGO!Power Miniature Power Supplies | New Product Brief

Siemens LOGO!Power Miniature Power Supplies are compact units designed for small distribution boards. Watch and learn all about their features, specs, applications, and more!


My Favorites From Sensors Converge 2024

My Favorites From Sensors Converge 2024

A short recap of some of the most interesting technologies I was able to see while walking the show floor this year.


News Jun 28, 2024 by Dale Wilson
EDA Companies Unite With Samsung for AI and 3D IC Technology

EDA Companies Unite With Samsung for AI and 3D IC Technology

At DAC 2024, leading EDA companies partnered with Samsung to help realize its AI technology roadmap led by process nodes SF2Z and SF4U.


News Jun 28, 2024 by Arjun Nijhawan
TDK Launches Sensor Partner Program and MEMS Microphone

TDK Launches Sensor Partner Program and MEMS Microphone

TDK is building a collaborative ecosystem around its InvenSense MEMS sensors for IoT, wearable, hearable, AR/VR, and robotics applications.


News Jun 28, 2024 by Jake Hertz
Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers

As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon lifecycle management (SLM) strategy that ensures a successful future for your designs.


Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans | New Product Brief

Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans | New Product Brief

Sanyo Denki San Ace 40L 9LG High Static Pressure Long Life Fans are designed for demanding applications, offering a maximum static pressure of 1780 Pascals and high airflow. Watch and learn all about their features, specs, applications, and more!


Top EDA Vendors Reveal Plans to Support Intel Foundry

Top EDA Vendors Reveal Plans to Support Intel Foundry

It's DAC 2024 week, and Intel Foundry, the "world’s first systems foundry for the AI era," is getting a boost from top EDA vendors Ansys, Siemens, Cadence, and Synopsys.


News Jun 27, 2024 by Duane Benson
RISC-V Summit Europe News—Processor IP, Verification Tools, and More

RISC-V Summit Europe News—Processor IP, Verification Tools, and More

At every point in the design process, RISC-V developers can make use of the advancements presented at RISC-V Summit Europe.


News Jun 26, 2024 by Aaron Carman
Understanding Magnetic Field Energy and Hysteresis Loss in Magnetic Cores

Understanding Magnetic Field Energy and Hysteresis Loss in Magnetic Cores

In this article, we use the concept of magnetic field energy to explore the relationship between a core's hysteresis loss and its B-H curve.